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Degumming machine and degumming method

A glue machine and machine base technology, applied in the field of glue remover, can solve problems such as poor packaging quality, residual glue on the substrate around the chip, and product yield decline.

Active Publication Date: 2015-11-25
MUTEK TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] After the packaging process, residual glue tends to remain around the chip and on the substrate, resulting in poor packaging quality and a decrease in product yield. Therefore, how to effectively overcome the aforementioned problems is a subject for further improvement.

Method used

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  • Degumming machine and degumming method

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Embodiment Construction

[0069] The foregoing and other technical contents, features and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. Through the description of specific implementation methods, the technical means and effects of the present invention to achieve the intended purpose can be understood more deeply and specifically, but the embodiments shown in the drawings are only for reference and illustration, and are not used to explain the present invention. be restricted.

[0070] figure 1 It is a schematic diagram of a packaging component 1 after the packaging process. A plurality of packaging gels 12 that respectively cover the chip (not shown) are formed on a substrate 11 of the packaging component 1. Usually, after the packaging component 1 passes through the packaging process, the packaging Surplus glue (not shown) tends to remain around the chip of the device 1 and on th...

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PUM

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Abstract

A glue removing machine and a glue removing method are suitable for removing glue remaining on encapsulated components after the encapsulating process. The glue removing machine comprises a machine base, a conveying device, a soaking device and a flushing device. The conveying device can convey the encapsulated components in the conveying direction. A liquid storage barrel of the soaking device forms a soaking tank, reagents used for softening glue remaining on the encapsulated components are contained in the soaking tank, bearing frames are arranged in the soaking tank and used for bearing the encapsulated components, a driving mechanism is used for driving the bearing frames to move in the soaking tank, lifting mechanisms are used for driving the bearing frames in discharge preparation positions to move away from the soaking tank in the first moving direction, and a pushing mechanism is used for pushing the encapsulated components borne by the bearing frames to the conveying device. The flushing device is used for spraying water onto the encapsulated components on the conveying device to remove the glue remaining on the encapsulated components.

Description

technical field [0001] The invention relates to a glue remover, in particular to a glue remover and a glue remover used to remove residual glue left on a packaged component after a package process. Background technique [0002] In the current semiconductor chip packaging process, a substrate carrying a semiconductor chip is usually placed in a mold cavity of a mold, and then the solid packaging material is heated to a molten state, and the molten packaging material is injected into the mold cavity to encapsulate the semiconductor chip. Covering the surface of the chip and the substrate, the encapsulation material in the molten state is solidified to form an encapsulation gel. [0003] After the encapsulation process, residual glue is likely to remain around the chip and on the substrate, resulting in poor encapsulation quality and lower product yield. Therefore, how to effectively overcome the aforementioned problems is a subject for further improvement. Contents of the in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B08B3/08B08B3/02B08B13/00H01L21/00
CPCB08B3/022B08B3/08
Inventor 易健民
Owner MUTEK TECH CO LTD
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