An infrared perspective imaging detection chip

Abstract

The invention discloses an infrared perspective imaging detecting chip which a ceramic shell, a metal support, a heat dissipation board, a drive control and perspective image preprocessing module, an area array non-refrigeration infrared detector and an area array infrared refraction micro lens. The drive control and perspective image preprocessing module, the area array non-refrigeration infrared detector and the area array infrared refraction micro lens are coaxially and sequentially arranged in the ceramic shell. The rear portion of the ceramic shell is arranged on the top of the metal support and the top of the heat dissipation board. The drive control and perspective image preprocessing module is arranged at the joint of the rear portion of the ceramic shell, the metal support and the heat dissipation board. The area array non-refrigeration infrared detector is arranged on the top of the drive control and perspective image preprocessing module, and the area array infrared refraction micro lens is arranged on the top of the area array non-refrigeration infrared detector. The infrared perspective imaging detecting chip is compact in structure and has the advantages that single-chip perspective imaging detection is performed on an infrared target based on an infrared beam direction, the measuring precision is high, the infrared perspective imaging detecting chip is easily compatible or coupled with a conventional infrared optical system, and the adaptability of the target and the environment is good.

Description

technical field [0001] The invention belongs to the technical field of infrared imaging detection, and more specifically relates to an infrared perspective imaging detection chip. Background technique [0002] In recent years, large area array infrared focal plane imaging detection technology has continued to develop rapidly. So far, the array size of infrared photosensitive chips has increased to one million, and it is still increasing rapidly. The minimum structural size of infrared photosensitive elements with high photoelectric sensitivity has been reduced to tens of nanometers. Ultra-large area array infrared quantum photosensitive structures, such as typical quantum wires or quantum dot arrays, are brewing new breakthroughs. The integrated architecture of chip infrared photoelectric detection and image information processing has broken through the key technical bottleneck. In addition, infrared imaging detection technology based on identifiable beam direction has al...

AI Technical Summary

Problems solved by technology

There are defects such as large volume and power consumption of the imaging device, high cost, low imaging efficiency, poor adaptability to the target and the environment, etc.

[0004] As far as the environmental medium is concerned, its shielding effect on infrared light waves usually only covers a limited beam direction, and it is difficult to cover target beams in all directions

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