An infrared imaging detection chip based on wave vector measurement

An infrared imaging and chip technology, applied in the direction of electric radiation detectors, etc., to achieve the effects of high structural stability, large measurable range, and high measurement accuracy

Active Publication Date: 2016-04-20
HUAZHONG UNIV OF SCI & TECH
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  • Abstract
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  • Claims
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Problems solved by technology

The above factors lead to the fact that the image quality of infrared imaging detection based on focal plane architecture is much lower than that of visible light images, and this situation will remain for a long time

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  • An infrared imaging detection chip based on wave vector measurement
  • An infrared imaging detection chip based on wave vector measurement
  • An infrared imaging detection chip based on wave vector measurement

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Embodiment Construction

[0024] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0025]Generally speaking, the infrared outgoing light wave of the target spreads and propagates in a gradually increasing airspace. The difference in energy transfer efficiency of beams with different wave vector directions reflects the property that the ability of the target or its different parts to project infrared energy to the surrounding airspace is different, which can be attributed to...

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Abstract

The invention discloses a wave vector measurement based infrared imaging detection chip comprising an area-array infrared refraction micro-lens, an area-array uncooled infrared detector and a driven and controlled preprocessing module. The area-array uncooled infrared detector is located at the position of a focal plane of the area-array infrared refraction micro-lens and divided into a plurality of secondary area-array uncooled infrared detector in array distribution, and each secondary area-array uncooled infrared detector comprises a plurality of photosensitive elements in array distribution and identical in number and arrangement mode; the area-array infrared refraction micro-lens comprises a plurality of infrared refraction micro-lens units in array distribution, and each infrared refraction micro-lens unit corresponds to one secondary area-array uncooled infrared detector. The wave vector measurement based infrared imaging detection chip is large in variation range of measurable infrared wave vector direction, high in measuring accuracy, compact in structure, good in environmental suitability, and easy to match and couple with conventional infrared optical systems and electronic and mechanical devices.

Description

technical field [0001] The invention belongs to the technical field of infrared imaging detection, and more specifically relates to an infrared imaging detection chip based on wave vector measurement. Background technique [0002] Generally speaking, when the multi-directional infrared beams emitted from the target are transmitted in the atmosphere, they show a spatial distribution form such as gradual divergence. The difference in energy transfer effectiveness of beams with different wave vector directions reflects the different properties of the target and its different parts in their ability to project infrared energy into the surrounding airspace. This property can be attributed to the directional difference of the power flow distribution of the optical field caused by the change of the wave vector direction of the transmission beam. That is to say, closely related to the structure, shape, attitude, orientation and distance of the target, the changes in the spatial dist...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01J5/10
Inventor 张新宇罗俊康胜武佟庆梁巢兵王文桑红石谢长生
Owner HUAZHONG UNIV OF SCI & TECH
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