Grinding fluid distribution arm

Abstract

The invention relates to a grinding fluid distribution arm, which belongs to the technical field of semiconductor. The grinding fluid distribution arm is positioned just above a grinding table, and can comprise a first mechanical arm, a second mechanical arm and a control module, wherein the first mechanical arm is connected with one end of the second mechanical arm; the other end of the second mechanical arm is provided with a grinding fluid output port; the control module realizes control over the grinding fluid spray direction of the grinding fluid output port by controlling the swing of the first mechanical arm, the swing of the second mechanical arm and the rotation of the grinding fluid output port. According to the grinding fluid distribution arm, the control of the flow can be realized and the relative positions of the grinding fluid output port and the grinding table can also be adjusted by controlling the swing of the first mechanical arm, the swing of the second mechanical arm and the rotation of the grinding fluid output port through the control module, so that the control over the grinding fluid spray direction of the grinding fluid output port is realized, and finally the linear and distributed control is realized.

Description

Technical field [0001] The present invention relates to the field of semiconductor technology, in particular to a polishing liquid distribution arm. Background technique [0002] With the widespread application of chemical mechanical polishing and the development of manufacturing processes, it is necessary to carry out the chemical electroplating of copper and the chemical mechanical polishing of copper successively on the base material. However, in terms of production capacity, the production of chemical mechanical polishing is slower than the chemical electroplating of copper at the previous station. Therefore, in general, chemical mechanical polishing has become a big bottleneck restricting the production capacity of the subsequent copper process. [0003] At present, many chemical mechanical polishing equipment manufacturers have developed new equipment to improve the production capacity of chemical mechanical polishing. However, the common solution for these chemical mechanic...

AI Technical Summary

Problems solved by technology

[0005] However, in the prior art, through the adjustment of the rotational speed of the grinding head and the grinding table, the control of the profile and non-uniformity of the wafer is nonlinear, and it is difficult to achieve the required flatness only by adjusting the rotational speed

Also, slurry-related adjustments are limited to flow, not distributed

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