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Phosphorus-containing binding resin and synthetic method thereof

A technology of adhesive resin and phenol, which is applied in the field of adhesive resin and its synthesis, can solve the problems of low adhesive performance, low activity, difficult three-dimensional network crosslinking structure, etc., and achieve the effect of less content and lower product cost

Active Publication Date: 2014-02-05
JIANGSU QIXIANG HIGH NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, its adhesive performance is lower than that of resorcinol, and its aging resistance is not good. The reason is that its activity is low and it is difficult to form a three-dimensional network crosslinked structure.

Method used

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  • Phosphorus-containing binding resin and synthetic method thereof
  • Phosphorus-containing binding resin and synthetic method thereof
  • Phosphorus-containing binding resin and synthetic method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] (1) Weigh raw materials according to 1 mole of phenol, 1.5 moles of resorcinol, 2.5 moles of formaldehyde, and 0.05 moles of sodium hydroxide, add the above raw materials into the reaction kettle, heat to 80 ° C, stir with a stirrer, and Reaction at ℃ for 3 hours;

[0029] (2) Raise the temperature of the reactor to 130°C, and add 0.25 moles of hydroxyethylene diphosphonic acid, continue to react in the reactor for 10 hours, and keep stirring;

[0030] (3) Vacuum dehydration, and then pour out the viscous liquid in the reaction kettle, which is the organic phosphonic acid modified adhesive resin.

Embodiment 2

[0032] (1) Weigh the raw materials according to 2 moles of phenol, 2 moles of resorcinol, 4 moles of formaldehyde, and 0.1 moles of sodium hydroxide, add the above raw materials into the reaction kettle, heat to 85°C, stir with a stirrer, and Reaction at ℃ for 2 hours;

[0033] (2) Raise the temperature of the reactor to 150°C, and add 0.4 moles of aminotrimethylene phosphonic acid, continue to react in the reactor for 6 hours, and keep stirring;

[0034] (3) Vacuum dehydration, and then pour out the viscous liquid in the reaction kettle, which is the organic phosphonic acid modified adhesive resin.

Embodiment 3

[0036] (1) Weigh the raw materials according to 4 moles of phenol, 4 moles of formaldehyde, and 0.05 moles of sodium hydroxide, add the raw materials into the reaction kettle, heat to 90°C, stir with a stirrer, and react at 90°C for 1 hour;

[0037] (2) Raise the temperature of the reactor to 140°C, and add 0.5 mole of diethylenetriaminepentamethylenephosphonic acid, continue to react in the reactor for 8 hours, and keep stirring;

[0038] (3) Vacuum dehydration, and then pour out the viscous liquid in the reaction kettle, which is the organic phosphonic acid modified adhesive resin.

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Abstract

The invention provides a phosphorus-containing binding resin having a structural formula shown in the description.

Description

technical field [0001] The invention relates to the field of resins used in the rubber industry, in particular to an adhesive resin and a synthesis method thereof. Background technique [0002] Resorcinol-formaldehyde resin is commonly used in the rubber tire industry as an adhesive between steel cords and polyester cords and rubber. It reacts with methylene donors to produce adhesion and is used for rubber and skeleton. Bonding of materials. It does not contain free formaldehyde and has a very low vapor pressure, greatly reducing the problems of smoke and weight loss that occur when using resorcinol monomer at processing temperatures above 150 °C. [0003] The price of resorcinol has been high all the time, monopolized by several large companies, especially a few foreign-funded companies, and the source of raw materials is limited, which greatly increases the production cost. Moreover, the residual free resorcinol content of resorcinol-formaldehyde resin is still very hig...

Claims

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Application Information

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IPC IPC(8): C08G8/32C09J161/14
Inventor 尹兴昌
Owner JIANGSU QIXIANG HIGH NEW MATERIAL