Mechanical arm operating system

Abstract

The invention discloses a mechanical arm operating system which comprises a vacuum chamber, a double-end mechanical arm and a driving device. The double-end mechanical arm is arranged in the vacuum chamber, the driving device is arranged outside the vacuum chamber, a transmission device is arranged between the double-end mechanical arm and the driving device, and the driving device transmits power to the double-end mechanical arm through the transmission device and drives the double-end mechanical arm to carry out bidirectional stretching and drawing, lifting and / or rotation. The transmission device comprises at least one corrugated pipe, and the corrugated pipe is sealed between the driving device and the double-end mechanical arm. Due to the fact that the corrugated pipe is sealed, the mechanical arm operating system can be used in an ultrahigh vacuum environment with a vacuum degree superior to 10-8Pa. Due to the double-end stretching and drawing mode of the double-end mechanical arm, two kinds of different articles can be conveyed, operating efficiency is improved, and flexibility is improved. For example, one end of the double-end mechanical arm can be used for conveying heavy sample trays, and the other end of the double-end mechanical arm can be used for conveying small samples. The maximum conveying distance is larger than the radius of the vacuum chamber and can be 1.6 times of the radius of the chamber body, and the space of the chamber where the double-end mechanical arm is located is utilized to the greatest degree.

Description

technical field [0001] The invention relates to a manipulator, in particular to a manipulator operating system. Background technique [0002] With the development of semiconductor technology, the vacuum level requirements for related equipment are getting higher and higher. This is because the vacuum environment can reduce the influence of the surrounding atmosphere. If the pressure in the vacuum chamber is 10 -4 At Pa, the surface of the substrate can be covered with a monomolecular layer of residual gas in 1 second, so depositing a film under ultra-high vacuum conditions can reduce the participation and influence of residual gas, and reduce impurities and defects on the surface and interface. The pressure in the vacuum chamber is 10 -8 Pa, it takes 8.5 hours to cover a layer on the substrate, so it has become the mainstream of semiconductor device manufacturing equipment. In the process of device manufacturing, it is necessary to use mechanical transmission devices to ...

AI Technical Summary

Problems solved by technology

There are a small number of foreign products that can realize the sample transmission under this vacuum degree, but there are the following disadvantages: the frog-type manipulator has a relatively compact structure, but the transmission distance is smaller than the diameter of the cavity; head mode, only one type of sample can be transferred, and the product output rate is low

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