Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Lead frame with inclined bending portion

A lead frame and lead frame technology, which is used in semiconductor/solid-state device parts, electrical components, electric solid-state devices, etc., can solve the problems of uneven stress on materials, skewed base surface of lead frames, and difficulty in industrialized large-scale production. To achieve the effect of reducing production costs and avoiding defective products

Inactive Publication Date: 2014-02-05
沈健
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] During the production process of the lead frame, the material is not uniformly stressed when it is bent, which can easily cause the base surface of the lead frame to be skewed
Cause cost increase, not easy to industrialized mass production

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Lead frame with inclined bending portion
  • Lead frame with inclined bending portion
  • Lead frame with inclined bending portion

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] The present invention will be further explained below in conjunction with the accompanying drawings and embodiments.

[0018] Such as figure 1 , figure 2 with image 3 As shown, a lead frame with a bent part and an inclined part is composed of thirty lead frame units 1 connected in a single row. The frame unit 1 includes a positioning hole 3, a heat sink 4, a base body 5 and lead pins. The positioning hole 3 is provided on the connecting piece 2-3, and the diameter of the positioning hole 3 is 2.0 mm. The base body 5 has a width of 4 mm and a width of 2.8 mm.

[0019] The heat sink 4 is arranged on the connecting piece 2-1, and the lead pins include the middle lead pin 6 and the side lead pin 7, and the width of the middle lead pin 6 or the side lead pin 7 is 0.81mm

[0020] The middle lead pin 6 is fixedly connected to the base body 5 through the bonding part 8, the bond part 8 is bent, and the middle lead pin 6 and the side lead pin 7 are fixedly connected throug...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a lead frame with an inclined bending portion. The lead frame is formed through connection of thirty lead frame units in a single row. The lead frame units are fixedly connected with one another through connecting pieces. Each lead frame unit comprises a positioning hole (3), a cooling fin (4), a substrate (5) and a lead pin, the positioning holes are formed in the connecting piece (2-3), the cooling fins (4) are arranged on the connecting piece, each lead pin comprises a middle lead pin body (6) and a side lead pin body (7), each middle lead pin body (6) is provided with a bonding portion (8), each bonding portion (8) is provided with an inclined section (9), the middle lead pin bodies (6) and the substrates (5) are fixedly connected through the bonding portions (8), the bonding portions (8) are bent, and the middle lead pin bodies (6) and the side lead pin bodies (7) are fixedly connected through the connecting piece (2-2). According to the lead frame, defective products are not prone to being produced in the production process, and product quality meets standards.

Description

technical field [0001] The invention relates to a lead frame, in particular to a lead frame with an inclined bent portion. Background technique [0002] With the development of the electronics industry, more and more high-power semiconductor devices are packaged in plastic, which requires a lead frame suitable for plastic-encapsulated high-power devices. chip requirements. [0003] During the production process of the lead frame, the material is not uniformly stressed when it is bent, which can easily cause the base surface of the lead frame to be skewed. Cause cost to increase, be not easy to industrialized large-scale production. Contents of the invention [0004] The problem to be solved by the present invention is to provide a lead frame that is less likely to produce defective products and whose product quality meets the standard. [0005] In order to solve the above problems, the present invention provides a lead frame with an inclined bent part, which is composed...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/495
CPCH01L2924/0002H01L2924/00
Inventor 沈健
Owner 沈健
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com