Surface-mount-device type heat sink high-light-efficiency LED lamp bead
An LED lamp bead, heat sink technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of low brightness, fast brightness decay, poor heat dissipation, etc., to improve the thermal conductivity, high thermal conductivity and high light efficiency, improve The effect of luminous efficiency and brightness
Inactive Publication Date: 2014-02-05
山东光因照明科技有限公司
View PDF4 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0003] The invention provides a patch type heat sink type high light efficiency LED lamp bead to solve the problems of low brightness, poor heat dissipation and fast brightness decay in the prior art
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0011] As shown in the figure, a patch-type heat-sinking high-efficiency LED lamp bead is mainly composed of a bracket, a chip 2 and a gold wire 7. The technical solution adopted to solve the technical problem is that the bracket is a heat-sinking patch bracket. The heat sink type patch bracket 1 is provided with an independent bowl cup 3, and the chip 2 is fixed on the heat sink type patch bracket 1 through the high thermal conductivity crystal-fixing silver glue in the bowl cup 3, and the heat sink type patch bracket 1 is provided with two Set the positive pin 10 and the negative pin 9, the positive end of the chip 2 is connected to the positive pin 10 in the positive bonding area 6 through the gold wire 7, and the negative end of the chip 2 is connected to the negative electrode in the negative bonding area 5 through the gold wire 7 The pin 9 is connected, the bowl cup 3 of the heat sink type patch support 1 is poured with folded fluorescent glue 8 , and the upper corner of ...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a surface-mount-device type heat sink high-light-efficiency LED lamp bead which is mainly composed of a support, a wafer and metal wires. The support is a heat sink type surface-mount-device support which is provided with an independent bowl cup, the wafer is fixed at the position, located inside the bowl cup, of the heat sink type surface-mount-device support through high thermal conductivity wafer fixing elargol, the heat sink type surface-mount-device support is provided with two sets of positive pole pins and negative pole pins, the positive pole end of the wafer is connected with the positive pole pins in a positive pole routing area through the metal wires, and the negative pole end of the wafer is connected with the negative pole pins in a negative pole routing area through the metal wires. According to the surface-mount-device type heat sink high-light-efficiency LED lamp bead, as the high thermal conductivity wafer fixing elargol and the heat sink type surface-mount-device support are adopted, the thermal conductivity effect of materials can be effectively improved, high refraction fluorescent glue can effectively improve the light-emitting efficiency and the luminance, and the effects of high thermal conductivity, high light effects and low attenuation are accordingly achieved.
Description
technical field [0001] The invention relates to the technical field of lighting fixtures, in particular to a patch type heat sink type LED lamp bead with high light efficiency. Background technique [0002] At present, the structure of ordinary SMD lamp beads is composed of brackets, chips and gold wires. The LED light-emitting chip is a semiconductor chip. One end of the chip is fixed on the bowl cup with crystal-bonding glue, one end is the negative pole, and the other end is connected to the power supply. The positive pole of the LED is connected to the bowl cup through a gold wire, but the existing SMD LED lamp beads have low brightness, poor heat dissipation, and fast brightness decay. Contents of the invention [0003] The invention provides a patch type heat sink type high light efficiency LED lamp bead to solve the problems of low brightness, poor heat dissipation and fast brightness decay in the prior art. [0004] The present invention is mainly composed of a br...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/64H01L33/50
CPCH01L2224/48091H01L2224/48247H01L2224/48257H01L33/486H01L33/502H01L33/62H01L33/647
Inventor 王新
Owner 山东光因照明科技有限公司