Copper-clad plate glass cloth gluing apparatus

A cloth coating and copper-clad laminate technology, which is applied in the field of glass cloth coating devices for copper-clad laminates, can solve problems such as no space for installation, and achieve the effects of guaranteed quality, good implementation effect, and uniform coating

Inactive Publication Date: 2014-02-19
TONGLING HAORONG ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the limitation of the installation location and space, if only the glue groove is deepened, then the existing cylinder-driven glue groove lifting mechanism has no room for installation

Method used

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  • Copper-clad plate glass cloth gluing apparatus
  • Copper-clad plate glass cloth gluing apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0012] The content of the present invention will be described below in conjunction with specific embodiments.

[0013] Such as figure 1 Shown is the structural representation of the gluing device of the present invention, figure 2 Schematic diagram of its working structure. The gluing device is for uniform gluing of the glass cloth 1 , and the gluing device includes a main dipping tank 2 , a chain 3 , a cylinder 4 and a lifting frame 5 . The main dipping tank 2 is set directly under the glass cloth 1, the main dipping tank 2 is set on the lifting frame 5, the lifting frame 5 is directly placed on the ground, one end of the chain 3 is connected to the lifting frame 5, and the other end is connected to the cylinder 4, when the cylinder 4 When working, the chain 3 pulls the lifting frame 5 upwards, drives the main dipping tank 2 to move upwards, and finally dips the glass cloth 1 in the main dipping tank 2. Since the lifting frame 5 is placed on the ground, the height between...

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PUM

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Abstract

The invention relates to a copper-clad plate glass cloth gluing apparatus for uniformly gluing a glass cloth. The gluing apparatus comprises a primary dipping tank, a chain, a cylinder and a crane, the primary dipping tank is arranged just below the glass cloth and on the crane, the crane is directly placed on the ground, one end of the chain is connected to the crane, the other end of the chain is connected with the cylinder, and the cylinder drives the chain to upward pull the crane in order to drive the primary dipping tank to upward move for the dipping of the glass cloth in the primary dipping tank. The copper-clad plate glass cloth gluing apparatus changes the original driving of the elevation of scissor forks by the cylinder to the direct driving of the upward movement of the primary dipping tank by the crane, so an enough installation space is guaranteed, the depth of the primary dipping tank is improved by 300mm, the gluing time is prolonged, the gluing is uniform, the quality of PP sheets is guaranteed, and the enforcement effect is good.

Description

technical field [0001] The invention relates to a glass cloth gluing device for copper-clad boards, belonging to the technical field of printed circuit boards. Background technique [0002] Copper-clad laminate glass cloth glue is applied through the main dipping tank. The glass cloth glue coating time has a great relationship with the depth of the glue tank. In order to prolong the glue coating time, the glue tank must be deepened. However, due to the limitation of the installation location and space, if only the glue groove is deepened, there is no room for installation of the existing cylinder-driven glue groove lifting mechanism. [0003] In addition, the glass cloth after gluing is called PP sheet, and the PP sheet will have PP weight due to uneven gluing, and PP weight is related to the uneven glue solution in the glue tank. Therefore, how to prolong the gluing time and at the same time apply the gluing evenly has always been a technical problem to be solved urgently ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C3/12B05C11/10
Inventor 洪璜
Owner TONGLING HAORONG ELECTRONICS TECH
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