High-speed array chip mounter
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 浙江华企正邦自动化科技有限公司
- Publication Date
- 2014-02-19
Smart Images
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Abstract
Description
technical field
[0001] The invention relates to the field of placement machines, in particular to a high-speed array placement machine. Background technique
[0002] The placement machine is configured after the dispensing machine or screen printing machine. It is a device that accurately places surface mount components on the PCB pads by moving the placement head. It is divided into manual and fully automatic. Among them, the automatic placement machine is used to realize high-speed, high-precision, fully automatic placement of components, and is the most critical and complex equipment in the entire SMT production. In order to achieve high-speed and efficient placement, 10 or more placement heads will be installed on an existing machine, which is called an array placement machine. The placement head is mainly composed of the placement head base, the nozzle rod and the nozzle. Especially in the products of the LED industry, the length of the circuit board is 10cm-150cm, and...