Electroplating assisting plate, and electroplating apparatus using it

Abstract

The invention relates to an electroplating assisting plate, and an electroplating apparatus using it. The electroplating apparatus (such as a vertical continuous electroplating machine) includes an electroplating solution and at least one anode basket and a member for plating positioned in the electroplating solution, the electroplating assisting plate is arranged between the at least one anode basket and the member for plating, the length of at least one side of the electroplating assisting plate is greater than the length of the member for plating, and the electroplating assisting plate is made by using a non-conductive plastic material and has a plurality of pores; and in the electroplating process, the tunnel effect formed by the pores can guide cations (such as copper ions) in the electroplating solution to directly flow the nearest surface of the member for plating from the at least one anode basket (which is an anode), and can also guide the cations to straightly move to fully occupy the pores, and the extra cations of the portion of the anode basket (the anode) larger than the member for plating cannot obliquely enter the holes, so the extra cations cannot reach the member for plating in order to form a shielding effect, thereby the uneven thickness of a coat of the member for plating can be avoided, and there is no need to use present shield plates.

Description

technical field [0001] The invention relates to an electroplating auxiliary plate and electroplating equipment using the same. An electroplating auxiliary plate with several openings is arranged between the anode and the cathode of the electroplating equipment, and without using the existing shutter, It can make the plating thickness of the produced electroplating products average and good. Background technique [0002] The electroplating equipment used in the electroplating industry, such as vertical continuous electroplating machines, is performing electroplating operations such as copper plating on circuit boards. The first requirement is that the electroplating products should have uniform and good coating thickness. [0003] The traditional electroplating operation uses copper anodes, but the copper anodes will become thinner and thinner. In addition, a new anode is an iridium alloy anode mesh (insoluble anode), which is characterized by high current and fast electropla...

AI Technical Summary

Problems solved by technology

[0007] Though this V-shaped shutter 94 is set and can avoid the situation that the coating thickness of the workpiece 92 is uneven, this V-shaped shutter 94 will move up and down appropriately to match the peripheral position of the workpiece 92 to be coated, and in order to make the V-shaped shutter 94 To move the plate 94 up and down, it is necessary to set up a driving mechanism and its controller in addition, so the components of the electroplating structure are numerous and complicated, and it is inevitable that mistakes will occur when the V-shaped shutter 94 moves up and down.

[0008] Therefore, in order to produce uniform and good electroplating products in the electroplating industry, there is currently no complete electroplating equipment.

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