Target assembly welding method

Abstract

A target module welding method comprises the steps of providing a target and a backing plate, enabling a to-be-welded surface of the target to be provided with a first processing line, and enabling the backing plate to be provided with a groove for accommodating the target; removing the first processing line, forming a second processing line on the to-be-welded surface, and enabling the length of the second processing line to be smaller than that of the first processing line; forming a first brazing filler metal layer on the to-be-welded surface of the target after the second processing line is formed; forming a second brazing filler metal layer on the bottom surface of the groove of the backing plate; placing the target in the groove, utilizing a welding process to weld the first brazing filler metal layer and the second brazing filler metal layer, and forming a target module. Deformation of the target in the target module can be reduced through the target module welding method, and sputtering uniformity of the target in the formed target module is improved and the service life of the target module is prolonged so as to meet the long-term stable production and target use requirements.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for reducing deformation of a target during welding. Background technique [0002] Vacuum sputtering is a process in which electrons accelerate to the substrate under the action of an electric field and collide with argon atoms, ionizing a large number of argon ions and electrons, and the electrons fly to the substrate, and the argon ions accelerate bombardment sputtering under the action of an electric field Sputtering a large number of target atoms, the neutral target atoms (or molecules) are deposited on the substrate to form a film, and finally achieve the purpose of coating the surface of the substrate. [0003] In the semiconductor industry, the target assembly is composed of a target that meets the sputtering performance and a back plate with a certain strength. The back plate can play a supporting role when the target assembly is assembled to the sputt...

AI Technical Summary

Problems solved by technology

[0007] The technical problem solved by the present invention is that due to the large deformation of the target in the target assembly, the sputtering uniformity of the target is low, and the service life of the target assembly is short, which cannot meet the long-term stable production and use of the target. needs

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