Solar cell equipment and its self-weight soft contact conduction device

Abstract

The invention discloses a self-weight type soft contact conduction device used for conducting a silicon wafer. The self-weight type soft contact conduction device comprises a lower driven roller in rolling contact with the lower surface of the silicon wafer and an upper driving roller in rolling contact with the upper surface of the silicon wafer, wherein the upper driving roller forms rolling contact with the upper surface of the silicon wafer by self gravity and freely rotates up and down. The self-weight type soft contact conduction device disclosed by the invention has the beneficial effects that batch production cost is low, installation is simple, maintenance is convenient and wafer broken rate is low.

Description

Technical field [0001] The invention relates to a conduction device, which is applied to the conduction of silicon wafers on solar cell cleaning and electroplating coating equipment, in particular to a self-weight soft contact conduction device. Background technique [0002] Compared with the usual solar cell efficiency (16.5% for monocrystalline silicon cells and 15.5% for polycrystalline silicon), the Pluto technology battery has achieved a new breakthrough. It has achieved a high level in the solar industry without using higher-level silicon wafers. The basic requirements of efficiency, high stability and high power output can enable users to save costs and reduce the use area, especially suitable for applications such as roofs integrated with buildings. [0003] As the PLUTO technology is relatively advanced, the requirements for equipment are naturally high. However, so far there are still some defects in the PLUTO production line, which has caused great human and financial lo...

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Problems solved by technology

However, the inventors found that the existing soft contact conduction device has the following disadvantages: 1. The spring is expensive and easy to deform, and the deformed spring cannot be used and cannot be repaired (the service life is generally 1 to 6 months); 2. The spring It is easier to crush the silicon wafer (fragmentation rate 0.58%); 3. The spring is easy to oxidize, resulting in poor conductivity (above 46-146 ohms), and it needs to be disassembled and washed once every 7 days, which is time-consuming, water-intensive, labor-intensive and easily damaged; 4. Auxiliary connectors are added (Mercury conductive slip ring) consumption, pollution process and environment (mainly mercury leakage pollution), etc.

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