Spray-suction electroplating tank

Abstract

The invention discloses an ejection-suction electroplating bath. The ejection-suction electroplating bath is provided with a bath body in which a cathode electrode is arranged, the cathode electrode can be connected with an electroplated object with a through hole, an anode electrode and an ejection device are arranged on one side of the electroplated object in the bath, the ejection device is provided with a nozzle which faces the electroplated object and is used for ejecting electroplate liquid to the electroplated object, a suction device is arranged on the other side of the electroplated object in the bath, the suction device is provided with a suction inlet, and used for sucking the electroplate liquid in the bath, and enabling the electroplate liquid in the bath to flow from the ejection deice to the suction device in cooperation with the ejection device, so that the electroplate liquid is helped to enter the hole of the electroplated object, and an electroplating product can be electroplated in the hole. The ejection-suction electroplating bath disclosed by the invention has a beneficial effect that the thickness of the electroplating product in the hole can be uniform, thereby increasing the yield of the product.

Description

technical field [0001] The invention relates to the design of an electroplating tank, in particular to an electroplating tank in which an electroplating solution flows through a hole through a spraying and suction device. Background technique [0002] The known electroplating technology refers to immersing the cathode electrode in the electroplating solution containing cations, and the cations in the electroplating solution are combined with the anions of the cathode electrode through the flow of electrons, and a layer of product is attached on the cathode electrode. This is the case with circuit printing technology. According to the requirements, there are holes on the circuit board, and the electroplating solution must penetrate into the holes to plate the product in the holes; however, due to the increasingly finer products today, the smaller the holes, the larger the depth ratio. The immersion electroplating method is used to operate the electroplating, and the electrop...

AI Technical Summary

Problems solved by technology

According to the requirements, there are holes on the circuit board, and the electroplating solution must penetrate into the holes to plate the product in the holes; however, due to the increasingly finer products today, the smaller the holes, the larger the depth ratio. The immersion plating method is used to operate the electroplating, and the electroplating solution is difficult to enter the small holes of the circuit board, resulting in such as Figure 5 As shown, the thickness of the plating in the hole 7 is insufficient or the defective rate of the product is increased due to the uneven thickness of the plating product 71 inside and outside the hole

[0003] In order to solve the above problems, the method adopted by the known technology is to use a very low current and prolong the time for electroplating. This method not only prolongs the time required for the process, but also the plated product has rough crystals and poor ductility. Some other disadvantages; in addition, the cost of equipment required for electroplating at low currents is also greatly increased, so it is urgent to improve the known electroplating technology

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