Five-stage headphone and manufacturing method thereof

Abstract

The invention relates to the field of headphone technologies, particularly to a five-stage headphone and a manufacturing method thereof. The five-stage headphone and the manufacturing method thereof are characterized in that an elastic piece is formed by fixing five elastic strips in parallel on sides of a positioning plate, the center of every elastic strip is provided with a pre-pressed arc, the outer surface of the port of the headphone is provided with a five-stage boss, the pre-pressed arcs match with the five-stage boss arranged on the outer surface of the port of the headphone, and two processes of injection molding and metal stamping are utilized in the manufacturing method of the five-stage headphone. According to the five-stage headphone and the manufacturing method thereof, a four-stage interface is changed into a five-stage interface, so that signal and hardware access can be facilitated and meanwhile automated operation of the production can be achieved; the yield is improved due to the fact that an original production mode of riveting and pressing parts one by one is changed into a current automated production mode, the yield of production is improved to a large extent, not only the yield is doubled, but also the quality is improved to a large extent; the safety is improved due to the fact that after the production mode is changed into the automated production mode, the problem of personnel safety caused by misoperation and the problem of abnormity of products can be avoided.

Description

[technical field] [0001] The invention relates to the technical field of earphones, in particular to a five-stage earphone and a manufacturing method thereof. [Background technique] [0002] In the current field of earphone production, most of the interface is four-level interface. If the headphone interface of five-level interface is to be achieved, not only the length limit must be broken, but also the limit of process processing must be broken; after all, the original aperture must be completed. The production of level five is relatively difficult. At present, other solutions produce five-level headphone jacks through riveting, which is not only inefficient but also has a high defect rate, and it is still relatively difficult to realize automated production. Our invention realizes the effective combination of injection molding and shrapnel. With the original materials unchanged, the production of five-stage earphones and the rapid processing of rear-end wiring can also b...

AI Technical Summary

Problems solved by technology

[0002] In the current field of earphone production, most of the interface is four-level interface. If the headphone interface of five-level interface is to be achieved, not only the length limit must be broken, but also the limit of process processing must be broken; after all, the original aperture must be completed. Level 5 production is relatively difficult

At present, other solutions produce five-level headphone jacks by riveting, which not only has low efficiency but also has a high defect rate. It is still relatively difficult to realize automatic production.

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