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Removable component and electronic device including same

A technology for electronic devices and components, which is applied to the installation of support structures, etc., can solve problems such as the inability to meet the thickness of the whole machine and the inability to place the rear of the electronic device, and achieve the effect of meeting the thickness of the whole machine

Inactive Publication Date: 2014-03-26
SHENZHEN BVC SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

And more and more electronic devices will have various objects built in (for example, smart cards, network cards, etc.), and the traditional way of taking out is mostly to take out from the back cover of the electronic device, but such a structure can no longer meet the needs of the entire system. Machine thickness requirements, as an improvement, the back cover is often sealed in the prior art
But this will cause some objects that need to be taken out frequently (for example, smart cards or network cards, etc.) then cannot be placed at the rear of the electronic device

Method used

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  • Removable component and electronic device including same
  • Removable component and electronic device including same
  • Removable component and electronic device including same

Examples

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Embodiment Construction

[0018] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0019] Please refer to figure 1 , figure 1 is a schematic diagram of an electronic device according to an embodiment of the present invention. The electronic device 10 includes an opening 11 on the side, and the bracket 22 can be inserted through the opening 11 on the side of the electronic device. In this embodiment, a smart card or a network card may be carried on the tray 22 . But this is not intended to limit the present invention. In other embodiments, integrated circuits or chips can also be carried on the bracket 22 .

[0020] Please refer to figure 2 , figure 2 It is a schematic st...

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PUM

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Abstract

The invention provides a removable component and an electronic device including the same. The removable component, provided by the invention, is characterized by comprising a bracket, a first elastic piece and a second elastic piece, wherein the bracket includes an outer end arm; a pinhole is formed in the outer end arm; the first elastic piece is fixed in the electronic device through a first fixed piece and a second fixed piece; when the bracket is introduced in the electronic device, a first directional force is applied on the bracket; the second elastic piece is fixed in the electronic device through a third fixed piece, and is opposite to the pinhole; when the bracket is totally introduced in the electronic device, a second directional force is applied on the bracket, wherein the first directional force and the second directional force are both acting forces for each other. The removable component can be taken out from the side surface of the electronic device, so that the requirements of whole machine thickness and appearance integrality are satisfied.

Description

technical field [0001] The invention relates to the structural field of removable components, in particular to a removable component and an electronic device containing the component. Background technique [0002] With the rapid development of electronic devices, the thickness reduction of the whole device has become a mainstream trend. And more and more electronic devices will have various objects built in (for example, smart cards, network cards, etc.), and the traditional way of taking out is mostly to take out from the back cover of the electronic device, but such a structure can no longer meet the needs of the entire system. As an improvement, the back cover is usually sealed in the prior art. However, this will cause some objects that need to be taken out frequently (for example, smart cards or network cards, etc.) cannot be placed at the rear of the electronic device. [0003] Based on the above situation, objects that need to be taken out frequently (for example, s...

Claims

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Application Information

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IPC IPC(8): H05K7/14
Inventor 徐琨吴虞沈艳波冯攸文
Owner SHENZHEN BVC SCI & TECH
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