Tray structure of photoresist homogenizer

Abstract

The invention discloses a tray structure of a photoresist homogenizer. The tray structure comprises a silicon wafer bearing table and a vacuum wafer suction structure, wherein a silicon wafer bearing plane is arranged at the top end of the silicon wafer bearing table; a photoresist storage groove is formed inwards along the center of the silicon wafer bearing plane; the groove wall of the photoresist storage groove is shaped like an inwardly-concave circular arc; a circular-truncated-cone-shaped boss is arranged in the middle of the photoresist storage groove; the vacuum wafer suction structure comprises an upper end and a vacuum wafer suction opening; the vertical distance between the vacuum wafer suction opening and the silicon wafer bearing plane is greater than 3mm. Through the mode, photoresists can be effectively prevented from being sucked into the vacuum wafer suction opening through the tray structure of the photoresist homogenizer, so that insufficient suction force or blocking of the vacuum wafer suction opening, caused by suction of the photoresists, is avoided; meanwhile, owing to the large-capacity photoresist storage groove, a large number of photoresists which are thrown away can be stored, and the photoresists flowing into the photoresist storage groove are prevented from being thrown away again, so that a photoresist homogenizing table is prevented from being damaged.

Description

technical field [0001] The invention relates to the field of glue homogenizer equipment, in particular to a glue homogenizer tray structure. Background technique [0002] The existing photoresist leveling table adopts the method of vacuum suction to absorb the silicon wafer, but the existing silicon wafer holder cannot effectively prevent the photoresist from penetrating into the vacuum suction port during the shaking process, such as figure 1 In the prior art shown, the silicon wafer is in direct contact with the vacuum suction port. During the high-speed rotation of the homogenizer, the photoresist is expanded into a thin film by the combined action of rotating centrifugal force and surface tension. The glue drops thrown out to the edge of the silicon wafer, due to the pressure difference between the edge of the silicon wafer and the suction port of the wafer table and the surface tension of the colloid, part of the glue droplets on the edge of the silicon wafer will be su...

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Problems solved by technology

[0002] The existing photoresist leveling table adopts the method of vacuum suction to absorb the silicon wafer, but the existing silicon wafer holder cannot effectively prevent the photoresist from penetrating into the vacuum suction port during the shaking process, such as figure 1 In the prior art shown, the silicon wafer is in direct contact with the vacuum suction port. During the high-speed rotation of the homogenizer, the photoresist is expanded into a thin film by the combined action of rotating centrifugal force and surface tension. The glue drops thrown out to the edge of the silicon wafer, due to the pressure difference between the edge of the silicon wafer and the suction port of the wafer table and the surface tension of the colloid, part of the glue droplets on the edge of the silicon wafer will be sucked into the vacuum suction piece along the back of the silicon wafer In the mouth, thereby blocking the vacuum suction port, resulting in insufficient suction of the vacuum suction port, resulting in poor uniformity of the photoresist film, and at the same time causing damage to the coating table

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