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A method for preparing conductive microspheres suitable for conductive materials

A technology of conductive materials and microspheres, applied in the field of preparation of conductive metal-containing composite microspheres, can solve the problems of poor conductivity of gold layer, insignificant effect of surfactant, and unrepeatable dispersion effect.

Active Publication Date: 2015-09-23
苏州鑫导电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The method commonly used to solve the agglomeration of conductive gold balls during the formation of gold layers is to use surfactants. Chinese patent CN 102352495A discloses a method for preparing conductive gold balls. When the gold layer is directly formed on the surface of resin balls, surfactants are used. Hexaalkyltrimethylammonium bromide, but the effect of surfactant is not obvious, and even a small amount of use will affect the redox reaction of electroless plating, resulting in poor conductivity of the gold layer, and the resistance increases with time, so the formed conductive microspheres in Unreliable in the application environment
Chinese patent CN102977395A discloses a preparation method of conductive material composite microspheres, which uses alcohol amine compounds to directly form a nickel layer on the surface of resin balls, but its dispersion effect cannot be repeated in the preparation of forming a gold layer on the surface of nickel balls, so it is urgently needed Find an effective preparation method that can solve the problem of agglomeration of gold-containing composite microspheres

Method used

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  • A method for preparing conductive microspheres suitable for conductive materials
  • A method for preparing conductive microspheres suitable for conductive materials
  • A method for preparing conductive microspheres suitable for conductive materials

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Step 1: Prepare 6.75μm matrix material microspheres, ie, polymer cores of composite microspheres

[0053] Take 13.1g 26.0% polystyrene seed suspension aqueous solution with a particle size of 2.1μm, 450g deionized water, 0.23g 10% sodium dodecylbenzene sulfonate aqueous solution into a 2000mL four-neck round bottom flask, pour nitrogen into it, and stir Then heat to 60°C. Take 18.8g divinylbenzene, 123.8g 1,6-hexanediol diacrylate, 7.5g allyl methacrylate, 10.7g 10% sodium dodecylbenzenesulfonate aqueous solution, 165g deionized water, and mix Stir with a homomixer and add to a four-neck round bottom flask. After stirring for 2 hours, the temperature was lowered to 40°C, and 0.2g of 30% hydrogen peroxide was added. Take 1.1g tert-butyl hydroperoxide, 0.3g 10% sodium dodecylbenzenesulfonate aqueous solution, 65g deionized water, mix with a homomixer, add it to a four-neck round bottom flask, and then add 56.3g 20% Polyvinylpyrrolidone aqueous solution, 25g deionized wate...

Embodiment 2

[0055] Step two, synthesize polymer microspheres with polymer exterior

[0056] Take 400.0 g of the microsphere suspension obtained in Example 1 with 15.4% removal of small particles, and 150 g of deionized water into a 2000 mL four-neck round bottom flask, pour in nitrogen, and stir and heat to 70°C. Take 0.08g of sodium formaldehyde sulfoxylate, 0.36g of 10% sodium dodecylbenzenesulfonate aqueous solution, mix 25.6g of deionized water into a homogeneous solution, and add 13.0g of the homogeneous solution into a round bottom flask. Take 0.11g tert-butyl hydroperoxide and mix it with 12.9g deionized water to form a homogeneous solution. Take 2.8g of methyl methacrylate, 11.5g of glycidyl methacrylate, and 0.03g of 1,6-hexanediol diacrylate and mix them into a uniform monomer solution. Add 1.0 g of the above two aqueous solutions every 15 minutes, for a total of 180 minutes. Add 1.3 g of the above monomer solution every 15 minutes, for a total of 150 minutes. After the aqueous ...

Embodiment 3

[0058] Step 3: Generate functional groups outside the polymer microspheres, namely the polymer microspheres obtained in functionalized embodiment 2

[0059] Take 100.0 g of the microsphere suspension obtained in Example 2, 200 mL of absolute ethanol, add it to a 500 mL round-bottomed flask, magnetically stir to disperse, and then take 50 mL of ethylenediamine and add it to the round-bottomed flask. Heat to 80°C for 12 hours. Cool the flask to 25° C., filter and separate to obtain functionalized microspheres, that is, form a functional part on the core, and the functional part is composed of high molecular polymer and has functional groups.

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Abstract

The invention provides a preparation method of a conductive micro-sphere applicable to a conductive material. The preparation method comprises the steps that a polymer composite micro-sphere with a functionalized external part and at least one metal conductive layer contacts a quaternary phosphate compound, and at least one metal conductive layer is formed at the outer layer of the composite micro-sphere in the environment of quarter phosphoric acid salt. The preparation method has the beneficial effects that the formed conductive composite micro-sphere is easily dispersed and is not easily reunited, and can be evenly distributed into various application media. Thus, the conductive composite micro-sphere has good conductivity, and the problem of negative effects on the conductivity caused by resistance rising due to poor contact of a microelectrode subjected to hot-pressing is solved.

Description

Technical field [0001] The invention relates to a conductive material, in particular to a method for preparing conductive metal-containing composite microspheres suitable for conductive materials. Background technique [0002] Conductive materials are widely used in the field of electrical connection between microelectrodes of electronic equipment. The main conductive connection is composed of conductive composite microspheres. The conductive composite microspheres can be used directly, such as distributed between the microelectrodes of the upper and lower frame lines of the flat display; Conductive composite microspheres can also be dispersed in an insulating resin binder to form anisotropic conductive materials, and then used to bond and conductively connect microelectrodes of electronic devices. With the changes in market demand, microelectrodes are gradually shrinking and the display area of ​​flat-panel displays is gradually increasing, and the performance requirements for c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B01J13/02C23C18/31
Inventor 江必旺吴俊成陈荣姬朱咸浩
Owner 苏州鑫导电子科技有限公司