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Hot-melt conductive adhesive and preparation method thereof

A conductive adhesive, hot-melt technology, applied in the field of conductive adhesive, can solve the problems of short circuit of cells and increase safety risks, and achieve the effects of increasing aging resistance, enhancing electrical conductivity, good acid and alkali resistance and flexibility

Active Publication Date: 2020-03-20
YANTAI DARBOND TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The use of ultrasonic welding at the tabs of the existing pouch batteries can easily lead to short circuits inside the battery cells, which increases the safety risk. To solve this problem, the present invention provides a hot-melt conductive adhesive and its preparation method

Method used

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  • Hot-melt conductive adhesive and preparation method thereof
  • Hot-melt conductive adhesive and preparation method thereof
  • Hot-melt conductive adhesive and preparation method thereof

Examples

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Effect test

Embodiment 1

[0022] A preparation method of hot-melt conductive adhesive: In a 2L double planetary kettle with heating reaction, add 200g of ethylene, propylene, butene Evonik 703 copolymer resin, 100g of ethylene, propylene, butene Evonik 206 copolymer modified resin , 1010 antioxidant 1g, then heated and melted under the protection of nitrogen, kept the temperature at 240-260°C for 0.5h, the stirring speed was 500r / min, and finally added HCA-1 nickel powder 900g from Novamet Company to continue stirring, the speed was controlled At 500r / min, after stirring evenly, the material is discharged into an aluminum packaging tube at 260-270°C.

Embodiment 2

[0024] A preparation method of hot-melt conductive adhesive: In a 2L double planetary kettle with heating reaction, add ethylene, propylene, butene Evonik 703 copolymer resin 100g, ethylene, propylene, butene Evonik 206 copolymerization modified resin 200g , 1g of 1010 antioxidant, then heated and melted under the protection of nitrogen, kept the temperature at 240-260°C for 0.5h, the stirring speed was 500r / min, and finally added 900g of Canadian Oerlikon1231 nickel powder and continued to stir, the speed was controlled at 500r / min , after stirring evenly, the material is discharged in an aluminum packaging tube at 260-270°C.

Embodiment 3

[0026] A preparation method of hot-melt conductive adhesive: In a 2L double planetary kettle with heating reaction, add 200g of ethylene, propylene, butene Evonik 703 copolymer resin, 100g of ethylene, propylene, butene Evonik 206 copolymer modified resin , 1010 antioxidant 1g, then heated and melted under the protection of nitrogen, kept the temperature at 240-260°C for 0.5h, the stirring speed was 500r / min, finally added 1200g of Canadian Oerlikon1232 nickel powder and continued stirring, the speed was controlled at 500r / min , after stirring evenly, the material is discharged in an aluminum packaging tube at 260-270°C.

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Abstract

The invention discloses a hot-melt conductive adhesive. The hot-melt conductive adhesive comprises the following components in parts by weight: 10-30 parts of olefin copolymer resin, 5-10 parts of modified olefin copolymer resin, 50-80 parts of nickel powder, 0.05-1 part of a surface treating agent and 0.01-1 part of an antioxidant 1010. The invention has the following beneficial effects: ethylene-propylene-butylene copolymer resin is adopted, and olefin enables resin to have good acid and alkali resistance and good flexibility; the siloxane-modified ethylene-propylene-butylene copolymer resinhas excellent interface bonding performance and can be firmly bonded with the added metal nickel powder; the added nickel powder serving as conductive powder can improve the aging resistance of the resin and enhance the conductivity of the resin; and the conductive adhesive disclosed by the invention can bear the corrosion of an electrolyte and is suitable for conductive connection of battery tabs.

Description

technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a hot-melt conductive adhesive and a preparation method thereof. Background technique [0002] The current conductive adhesives on the market are mainly composed of conductive particles and base resin, which exhibit excellent conductivity and adhesion after being fully cured. The conductive adhesives currently on the market include epoxy systems, acrylate systems, silicone systems, polyurethane systems and their hybrid systems. These systems need to be reacted and cured before they can be used, and the cycle is relatively long. [0003] The silicone system has low polarity, good aging resistance and solvent resistance, but poor bonding performance. Other epoxy systems and acrylate systems have certain limits. This polarity is difficult to withstand electrolyte immersion. [0004] At present, the welding of the tabs of the pouch battery is ultrasonic welding, but its...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J123/14C09J123/26C09J9/02C09J11/06
CPCC08K2003/0862C08K2201/001C08L2201/08C08L2203/20C09J9/02C09J11/06C09J123/14C09J123/26C08L23/26C08K3/08C08K5/1345C08L23/14
Inventor 王守立王建斌陈田安解海华
Owner YANTAI DARBOND TECH