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Coating for cooling surface of light-emitting diode (LED) radiator

A heat sink and coating technology, applied in the direction of reflection/signal coatings, coatings, etc., can solve the problems of high power LED light source heat generation, LED light source life, poor heat dissipation, etc., to achieve good coating process, protection The effect of good equipment and convenient construction

Active Publication Date: 2014-08-06
NINGBO AISHI ELECTRIC EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the higher requirements of energy saving, emission reduction and environmental protection, more and more LED light sources are used to replace traditional light sources; however, high-power LED light sources generate a lot of heat, and if the heat dissipation is not timely, it is easy to have a great impact on the life of LED light sources. influences
The LED light source and the substrate are bonded and welded together. The traditional heat dissipation mainly uses heat-dissipating resin at the bonding point to dissipate heat. However, as the temperature of the bonding point changes repeatedly, it is easy to affect the performance of the resin, causing the resin to age and peel off. , poor cooling effect, increased energy consumption

Method used

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  • Coating for cooling surface of light-emitting diode (LED) radiator
  • Coating for cooling surface of light-emitting diode (LED) radiator

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Experimental program
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Effect test

Embodiment

[0025] The preparation method is as follows:

[0026] (1) Weighing each component of the formula ratio, then adding the carbon nanotubes into ethanol at a temperature of 50-80°C, and stirring evenly;

[0027] (2) Then the inorganic colloidal particles are added, and the epoxy resin and methyl methacrylate mixing system are stirred evenly;

[0028] (3) Mix the solutions of step (1) and step (2), then add spinel after electronic transition, rare earth element oxide and stabilizer and stir evenly to obtain the heat dissipation coating for the surface of LED heat sink.

[0029] The spinel electron radiation mentioned above has an energy range of 1-1.5 MeV and a beam power of 2-20Kw for 0.2-3h to achieve electron transition. The spinel is ground to a particle size of less than 1000nm after electronic transition.

[0030] Table 1 embodiment 1-3 each component consumption

[0031]

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PUM

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Abstract

The invention discloses a coating for cooling the surface of a light-emitting diode (LED) radiator. The coating is characterized by being prepared from the following components in parts by weight: 6-20 parts of inorganic colloidal particle, 0.5-2 parts of carbon nano-tube, 15-80 parts of electron transition spinel, 0.05-2 parts of rare-earth element oxide, 0.1-0.3 parts of stabilizer, 3-10 parts of epoxy resin, 3-10 parts of methyl methacrylate and 2-5 parts of ethylene glycol. The coating has obvious heat dissipating and cooling effects, is not affected by surrounding medium when taking the cooling effect, can be used in a vacuum environment, also has the advantages of good self-cleaning property, corrosion resistance, waterproofness, fire retardancy, insulativity, and acid and alkali resistance, and convenient construction when taking a radiation cooling effect.

Description

technical field [0001] The invention relates to the technical field of coatings for cooling the surface of LED radiators, in particular to a coating for cooling the surfaces of LED radiators. technical background [0002] With the higher requirements of energy saving, emission reduction and environmental protection, more and more LED light sources are used to replace traditional light sources; however, high-power LED light sources generate a lot of heat, and if the heat dissipation is not timely, it is easy to have a great impact on the life of LED light sources. influences. The LED light source and the substrate are bonded and welded together. Traditional heat dissipation mainly uses heat-dissipating resin at the bonding point to dissipate heat. However, as the temperature of the bonding point changes repeatedly, it is easy to affect the performance of the resin, causing the resin to age and peel off. , the heat dissipation effect is poor, and the energy consumption is inc...

Claims

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Application Information

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IPC IPC(8): C09D4/02C09D5/33
Inventor 戴文良
Owner NINGBO AISHI ELECTRIC EQUIP
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