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Sputtering magnetron and method for dynamically influencing the magnetic field

A magnetron and sputtering technology, which is applied in the field of sputtering magnetrons, can solve problems such as the influence of sputtering results, and achieve the effect of uniform layer deposition

Inactive Publication Date: 2014-04-09
冯·阿德纳设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the case of large changes, also negatively affects the quality of the sputtering results

Method used

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  • Sputtering magnetron and method for dynamically influencing the magnetic field

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Embodiment Construction

[0035] A sputtering magnetron is described for coating a substrate with a target material 12 . The target 1 consists of a target support tube 11 and a target material 12 applied thereto. The target 1 is arranged between two end blocks 2 and is rotatably connected to each of the two end blocks 2 . The end block 2 is used to rotatably drive the target 1 and to supply power and coolant to the target 1 . For this purpose, one of the two end blocks 2 has a coolant feed line 21 connected to the barrel 13 arranged inside the target 1 , through which coolant is conveyed to the interior of the target 1 . another side.

[0036] Below a target 1 arranged in a coating installation (not shown here) for coating a substrate 3, a plate-shaped substrate 3 is moved through a sputtering magnetron, wherein the substrate 3 is deposited from the target 1 layer 12 of molten target material.

[0037] The gun barrel 13 simultaneously serves as a support device 41 for the magnet system 4 arranged i...

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Abstract

A sputtering magnetron for coating a substrate includes a target and a magnet system that can be displaced relative to one another. The magnet system forms a magnetic field that penetrates the target, and has a support apparatus, a support plate with magnets arranged thereon, and actuators. The support apparatus is connectable to the support plate by the actuators such that distance between the magnet system and the target can be set, at least in sections. A cooling circuit cools the magnet arrangement and the target by a coolant. A layer measuring device obtains data of layer properties of at least one layer deposited on the substrate. Magnet system controls evaluate the data obtained and generate manipulated variables employed as the input variables of the actuators. A method for dynamically influencing the magnetic field is also provided.

Description

technical field [0001] The invention relates to a sputtering magnetron for PVD coating of substrates, in particular to a sputtering magnetron with rotating target tubes, so-called tubular magnetrons, and to a sputtering magnetron during sputtering A method for dynamically influencing the magnetic field during processing. Background technique [0002] In the case of tubular magnetic spot tubes, the cathode and thus the target material arranged thereon rotate around a stationary magnet system, or a moving, for example rotating, magnet system moves inside the target. The magnetic field generated by the magnet system forms a racetrack on the surface of the target material, which extends essentially in two straight tracks along the target tube. Tubular magnetrons can reduce the target material yield (yield), thereby reducing sputtering costs. [0003] A known magnet system comprises a support device and a support plate with magnets arranged on the support plate and configured t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/35H01J37/34
CPCC23C14/35H01J37/3455H01J37/3405H01J37/347
Inventor 汉斯-于尔根·海因里希斯文·黑内罗尔夫·兰克
Owner 冯·阿德纳设备有限公司