Adjustable wafer fixing device and method and wafer cleaning platform

Abstract

The invention discloses an adjustable wafer fixing device and method and a wafer cleaning platform. The adjustable wafer fixing device comprises a plurality of fixing pins, a plurality of elastic devices, a motor and a plurality of sets of torque control systems, wherein the fixing pins are used for fixing wafers and can be installed at the edges of the wafers in an opening and closing mode; the elastic devices are correspondingly connected with the fixing pins and used for controlling movement of the fixing pins; the motor outputs currents or voltages and is used for controlling movement of the elastic devices; one ends of the torque control systems are connected with the elastic devices, the other ends of the torque control systems are connected with the motor, the torque control systems send out signals to control the currents or the voltages output by the motor to make the elastic devices positively or reversely move and then to change positions of the fixing pins. The problem that the wafers are damaged due to too large or too small torque of a part of the wafers because the fixing pins fix the wafers through fixed torque in an existing wafer fixing device is solved.

Description

technical field [0001] The invention relates to the field of semiconductor integrated circuit equipment, in particular to an adjustable wafer fixing device, method and wafer cleaning platform. Background technique [0002] In the integrated circuit manufacturing process, the wet processing process steps of multi-channel wafers are included. The so-called wet process is to soak or rinse the wafer with liquid chemicals such as acid-base organic matter, so as to achieve the purpose of cleaning surface particles, removing reactive polymers, and etching surface film layers. With the continuous improvement of the requirements for process effectiveness, the type of wet processing equipment has gradually changed from the early batch processing of wafers to the single wafer processing. [0003] Usually, the single-chip wafer processing method is as follows: the silicon wafer is placed on the chuck, the chuck platform rotates at high speed, the nozzle above the chuck sprays the chemi...

AI Technical Summary

Problems solved by technology

[0005] As mentioned above, the existing fixing pins contact the wafer with a fixed torque, but in the process of actual processing of the wafer, due to the slight difference in the placement position of the wafer or the difference in the size and quality of the wafer itself, such as using a fixed pin Torque acts on each contact point of the wafer, the actual force of the wafer is not the same, and in the wafer cleaning process, the chuck will rotate at a high speed, so the force of each contact point of the wafer may change at any time, which is The actual force acting on the wafer at some contact points is too large, which may easily cause cracks or damage to the wafer at the point of action

In addition, some special processes use very thin wafers, which require a small force to fix the wafers. If the torque for ordinary thickness wafers is still used, wafer fragments are prone to occur.

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