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A non-contact intelligent identification card inlay layer and its preparation method

A smart identification card, non-contact technology, applied in the field of preparation of non-contact smart identification cards, can solve problems such as low production process efficiency, and achieve the effects of improving efficiency, improving production efficiency, and reducing processes

Active Publication Date: 2018-12-28
SHANGHAI CHINA CARD SMART CARD CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0012] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a non-contact intelligent identification card INLAY layer and its preparation method for solving the problems of low efficiency of the existing production process

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  • A non-contact intelligent identification card inlay layer and its preparation method
  • A non-contact intelligent identification card inlay layer and its preparation method
  • A non-contact intelligent identification card inlay layer and its preparation method

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Embodiment Construction

[0026] The following describes the implementation of the present invention through specific specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention.

[0027] It should be noted that the illustrations provided in this embodiment only illustrate the basic idea of ​​the present invention in a schematic way, and the figures only show the components related to the present invention instead of the number, shape, and shape of the components in actual implementation. For size drawing, the type, quantity, and ratio of each component can be changed at will during actual implementation, and the compone...

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Abstract

The invention provides a non-contact intelligent identification card INLAY layer and a preparation method thereof. The preparation method comprises the following steps: (1) providing an IC module, an IC bearing module and an antenna bearing layer, drilling a first punched hole in the IC bearing layer, drilling a second punched hole used for being exposed out of the IC module and corresponding to the first punching hole in the antenna bearing layer, and filling the IC module into the first punched hole, (2) enabling the antenna bearing layer and the IC bearing layer provided with the IC module in a filling mode to be stacked from top to bottom and be bound into a whole body to form a blank, (3) coiling an antenna on the blank so as to enable the antenna to be formed on the antenna bearing layer, (4) enabling the coiled antenna to be electrically connected with the IC module so as to form the non-contact intelligent identification card INLAY layer. Compared with an existing process technology, two layers of materials or three layers of materials are bound together in a groundbreaking mode, the antenna is coiled, the IC module is welded with the antenna, so that tedious processes are reduced, and production efficiency is improved.

Description

Technical field [0001] The present invention relates to the field of preparation of non-contact smart identification cards, in particular to a non-contact smart identification card INLAY layer and a preparation method thereof. Background technique [0002] The non-contact smart identification card or device has no contact on the surface. The smart identification card or device communicates with the reader wirelessly (that is, transmitting and receiving electromagnetic waves). The core of the non-contact smart identification card or device is the INLAY layer. INLAY includes an IC module and an IC carrying layer, an antenna and an antenna carrying layer, and the IC module and the antenna must be welded to form an electrical connection. [0003] At present, INLAY's processing technology mainly has the following two types: [0004] The first is: the IC module is filled on the IC carrier layer according to the location requirements, and the IC carrier layer has punching holes, so that th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/077
Inventor 谷洪波
Owner SHANGHAI CHINA CARD SMART CARD CO LTD
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