Polyimide resin, resin composition and laminated film using same

Abstract

Provided are: a polyimide film in which volatile matter is not generated due to decomposition etc., and which has good adhesiveness, even at high temperatures of 250 DEG C and above; and a resin composition and a laminated film that use the polyimide film. The polyimide resin is characterized by having at least an acid dianhydride residue and a diamine residue, and a glass transition temperature of not more than 30 DEG C, and is further characterized in that the diamine residue contains a polysiloxane diamine residue represented by general formula (1). (n is a natural number, and has an average value, which is calculated from the average molecular weight of the polysiloxane diamine, of five to thirty. R1 and R2 may be the same or different, and each represents an alkylene group or a phenylene group with one to thirty carbons. R3 to R6 may be the same or different, and each represents an alkyl group, a phenyl group or a phenoxy group with one to thirty carbons.)(The formula is shown in the specification.)

Description

technical field [0001] This invention relates to heat resistant adhesives. More specifically, it relates to heat-resistant bonding of engineering materials, etc., which can be used in the manufacture of electronic devices without generating volatile components due to decomposition of the adhesive even in a high-temperature environment. agent. Background technique [0002] In the past, rubber-based adhesives such as natural rubber and styrene-butadiene rubber were often used as adhesives. However, since high heat resistance is required for engineering materials used in the manufacture of electronic equipment, acrylic resins are increasingly used. , Silicone resin. [0003] Since acrylic resins also have high transparency, they are widely used as optical materials for flat panel displays such as liquid crystal displays (for example, see Patent Document 1). , The acrylic resin itself decomposes to generate volatile components, so the heat resistance is not sufficient. Silic...

AI Technical Summary

Problems solved by technology

[0003] Since acrylic resins also have high transparency, they are widely used as optical materials for flat panel displays such as liquid crystal displays (for example, see Patent Document 1). , the acrylic resin itself decomposes to produce volatile components, so the heat resistance is not sufficient

Silicone-based resins have a wide operating temperature range from low temperature to high temperature, and exhibit higher heat resistance than acrylic resins (for example, see Patent Document 2), but they are longer at temperatures above 250°C, and furthermore, at temperatures above 300°C. When left for a long time, volatile components are generated due to decomposition, etc.

In addition, since silicone-based adhesives contain low-molecular-weight silicone components, they also have the problem of adversely affecting electronic components.

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