Drilling method for circuit board

Abstract

The invention discloses a drilling method for a circuit board and belongs to the technical field of circuit board production. The drilling method comprises the following steps of setting a positioning target and a directional target on the circuit board, drilling a positioning hole in the positioning target and drilling a directional hole in the directional target; enabling the number of the directional target to be one and arranging the directional target in an area which is outside a horizontal central line and a longitudinal central line; identifying the direction of the circuit board through the directional hole, enabling a pin to penetrate the positioning hole and installing and fixing the circuit board and a cover plate; drilling the circuit board in the front side and the rear side and enabling the drilled holes in the front side and the rear side to be through holes. The drilling method for the circuit board can achieve circuit board drilling with the high thickness-diameter ratio and obtain high accuracy hole location.

Description

technical field [0001] The invention relates to a method for preparing a circuit board, in particular to a method for drilling a circuit board. Background technique [0002] Drilling is a very important process in the PCB manufacturing process. Drilling holes on the circuit board is mainly used for the welding of circuit board components and the conduction between layers. At present, the drilling process of PCB boards is to use a drill to completely drill through from one side of the PCB to the other. For PCB boards with a high thickness-to-diameter ratio, when using ordinary drills to drill holes, it is limited by the length of the blade and cannot be drilled at one time. When using a drill with a longer blade length, it is easy to break because the strength of the drill is reduced. Once the drill is broken, it is difficult to take it out from the PCB, and the PCB will inevitably be scrapped. Moreover, board thickness is a very critical factor affecting the accuracy of the...

AI Technical Summary

Problems solved by technology

At present, the drilling process of PCB boards is to use a drill to completely drill through from one side of the PCB to the other. For PCB boards with a high thickness-to-diameter ratio, when using ordinary drills to drill holes, it is limited by the length of the blade and cannot be drilled at one time. When using a drill with a longer edge length, it is easy to break because the strength of the drill is reduced. Once the drill is broken, it is difficult to take it out from the PCB, and the PCB will inevitably be scrapped.

Moreover, board thickness is a very critical factor affecting the accuracy of the hole position. The thicker the PCB board, the lower the accuracy of the drilled hole position, especially the reverse side. As the thickness of the uncut material becomes thinner, it resists deformation. The ability to gradually weaken, resulting in the accuracy of the opposite face will become very poor

Therefore, it is difficult to achieve the problem of obtaining high-precision hole positions for such high-thickness-diameter-ratio PCB boards with general drilling methods.

Images