Integrated Circuit Components for Switching Regulators
A technology of integrated circuits and regulators, applied in the field of semiconductor packaging components, can solve problems such as adverse effects on performance
Active Publication Date: 2016-11-30
SILERGY SEMICON TECH (HANGZHOU) CO LTD
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- Claims
- Application Information
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Problems solved by technology
[0010] In view of this, the object of the present invention is to provide an integrated circuit assembly applied to a switching regulator to solve the problem in the prior art that its performance is adversely affected by the use of bonding wires
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[0029] Various embodiments of the invention will be described in more detail below with reference to the accompanying drawings. In the various drawings, the same elements are denoted by the same or similar reference numerals.
[0030] For the sake of clarity, various parts in the drawings have not been drawn to scale. For simplicity, the component structure obtained after several steps can be described in one figure. Furthermore, certain well-known details may be omitted, eg, solders are not shown in all drawings, support material for supporting a leadframe and / or an external frame is not shown in some drawings.
[0031] It should be understood that when describing a component structure, when a layer or a region is referred to as being “on” or “over” another layer or another region, it may mean that it is directly on another layer or another region, or on the There are other layers or regions between it and another layer or another region. And, if the device is turned over,...
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An integrated circuit assembly applied to a switching regulator is disclosed, comprising: a lead frame having a plurality of pins and a first substrate; first and second power device chips having first and third electrodes on the front side, respectively, There is a second electrode on the back; the control chip has first and second driving electrodes and a plurality of input and output electrodes on the front; wherein, the first electrode of the first power device chip is electrically connected to the first substrate through a conductive bump, the second The second electrode of the two power device chips is attached to the first substrate and is electrically connected to the first substrate; the third electrode of the first power device chip and the third electrode of the second power device chip are respectively electrically connected to the first driving electrode and the second driving electrode; the second electrode of the first power device chip and the first electrode of the second power device chip are respectively electrically connected to the pins of the lead frame. The integrated circuit component can reduce parasitic resistance and power consumption introduced by bonding wires, and utilize a large-area substrate to improve heat dissipation.
Description
technical field [0001] The present invention relates to semiconductor package assemblies, and more particularly to integrated circuit assemblies for use in switching regulators. Background technique [0002] Switching regulators, such as DC-DC converters, are used to provide a stable voltage source for a variety of electrical systems. High-efficiency DC-DC converters are especially required for battery management in low-power devices (such as laptops, cell phones, etc.). Switching regulators convert the input DC voltage to a high frequency voltage, and then filter the high frequency output voltage to convert it to a DC output voltage. Part of a switching regulator can be integrated in one package. [0003] With increasing demand for miniaturization, light weight and multi-functionalization of electronic components, it is desired to integrate more components in integrated circuit components applied to switching regulators while reducing package size. In addition to integra...
Claims
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IPC IPC(8): H01L25/16H01L23/495H01L23/367
Inventor 叶佳明
Owner SILERGY SEMICON TECH (HANGZHOU) CO LTD