Integrated circuit module applied to switching type adjuster

Abstract

The invention discloses an integrated circuit module applied to a switching type adjuster. The integrated circuit module comprises a power device chip, a control chip and a lead frame. The power device chip comprises a control electrode, a first electrode and a second electrode, wherein the control electrode and the first electrode are arranged on the front face of the power device chip, the second electrode is arranged on the back face of the power device chip, and the second electrode is used as a switch terminal of the switching type adjuster, the control chip comprises a driving electrode on the front face of the control chip and a plurality of input and output electrodes, the lead frame comprises an extension pin, a base and a plurality of split-off pins, and the extension pin and the base are formed integrally. The back face of the power device chip is attached and mounted on the base of the lead frame through conductive materials, the second electrode is electrically connected with the base, the control electrode is electrically connected with the driving electrode, and the input electrodes and the output electrodes of the control chip are electrically connected with the corresponding split-off pins respectively. The integrated circuit module applied to the switching type adjuster can reduce interference of the extension pin with other pins and avoid the electric leakage and failure phenomenon.

Description

technical field [0001] The present invention relates to semiconductor package assemblies, and more particularly to integrated circuit assemblies for use in switching regulators. Background technique [0002] With the increasing demand for miniaturization, light weight and multi-functionalization of electronic components, the requirements for semiconductor packaging density are getting higher and higher, so as to achieve the effect of reducing the package size. In addition to integrated circuit chips, semiconductor packages can also contain traditional discrete components such as inductors and power transistors. This minimizes the use of external components. In such integrated circuit assemblies, the configuration of the integrated circuit chip and discrete components and their connection methods have a critical impact on the size and performance of the packaged assembly. [0003] In the existing integrated circuit components applied to switching regulators, peak voltages a...

AI Technical Summary

Problems solved by technology

[0003] In the existing integrated circuit components applied to switching regulators, there will be peak voltages on the switching pins of the integrated circuit components applied to switching regulators, which will easily interfere with its adjacent pins and generate noise

Moreover, leakage failure may also occur

At the same time, the heat dissipation effect of the switch pins in the existing integrated circuit components is not good enough

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