High-precision three-dimensional posture inertia measurement system and method based on MEMS (Micro Electro Mechanical Systems)

A three-dimensional attitude and inertial measurement technology, applied in directions such as navigation through velocity/acceleration measurement, which can solve the problems of low accuracy and high sensor cost
CN103776451AInactive Publication Date: 2014-05-07HARBIN INST OF TECH
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Applications(China)
Current Assignee / Owner
HARBIN INST OF TECH
Publication Date
2014-05-07
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The invention discloses a high-precision three-dimensional posture inertia measurement system and method based on MEMS (Micro Electro Mechanical Systems), which relate to a high-precision three-dimensional posture inertia measurement method. The system and the method disclosed by the invention aim for solving the problems that the existing three-dimensional posture inertia measurement equipment is low in cost and low in precision due to adoption of a sensor. A three-axis gyroscope sensor is used for sending measured angular speed data to an ARM (Advanced RISC Machines) processor; a three-axis accelerometer sensor is used for sending measured acceleration data to the ARM processor; a three-axis magnetometer sensor is used for sending measured magnetic strength data to the ARM processor; a temperature sensor is used for measuring and sending obtained temperature excursion data of the three-axis gyroscope sensor to the ARM processor; the ARM processor is used for processing the received data by means of front low-pass digital filtration, front-end data processing and expansion Kalman filtration respectively so as to obtain Euler angle three-dimensional posture inertia data or quaternion three-dimensional posture inertia data. The system and the method disclosed by the invention can be applied to the field of navigation control.
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Description

technical field

[0001] The invention relates to a space three-dimensional attitude measurement method, in particular to a MEMS-based high-precision three-dimensional attitude inertial measurement method. Background technique

[0002] UAVs, robots, mechanical gimbals, vehicles and ships, virtual reality, human motion analysis, etc. have all achieved rapid development in recent years. In these applications, the autonomous measurement of three-dimensional attitude and orientation is extremely important. Among the existing three-dimensional attitude and orientation sensors, MEMS sensors are low in cost, but the measurement data cannot meet the accuracy requirements of the above applications due to large errors such as zero bias and temperature drift; while some IMU modules can be used in terms of accuracy It meets the requirements, but the high cost limits its practical application. Contents of the invention

[0003] The invention aims to solve the problems of high cost and ...

Claims

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