Heating device of semiconductor heat treatment device, service part of heating device and repair method of heating device
A technology of heat treatment equipment and heating device, which is applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., and can solve problems such as short contact of heating wire 31, loss of support, and suspension of heating wire 31
Active Publication Date: 2014-05-07
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Problems solved by technology
As shown in the figure, after the damaged insulating part 32 falls off, the heating wire 31 here will appear suspended and lose support, and it is easy to contact with the adjacent heating wire 31 for short connection
Method used
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[0032] The specific embodiment of the present invention will be further described in detail below in conjunction with the accompanying drawings.
[0033] It should be noted that please combine figure 1 refer to Figure 6 , a heating device for semiconductor heat treatment equipment of the present invention, including figure 1 In addition to the heat insulating layer 2 of the furnace body, the heating wire 31 and the supporting insulating part 32 for fixing the heating wire on the insulating layer 2, an auxiliary maintenance insulating part 33 is also included.
[0034] In this embodiment, as shown in the figure, the heating wire 31 is wound into a spiral shape and installed against the inner wall surface of the furnace body insulation layer 2, and the supporting insulating member 32 is embedded in the insulation layer 2, and the heating wire 31 is arranged at a certain distance. Wires 31 are mounted on the inner surface of the insulation layer 2 . When the heating device of...
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The invention relates to a heating device of a semiconductor heat treatment device, a service part of the heating device and a repair method of the heating device. The heating device of the semiconductor heat treatment device comprises a furnace body heat-insulating layer, a heater strip and a supporting insulating part, wherein the heater strip is fixed to the furnace body heat-insulating layer through the supporting insulating part. The heating device of the semiconductor heat treatment device further comprises an auxiliary repair insulating part, wherein the auxiliary repair insulating part is erected between two adjacent sections, needing special reinforced insulation, of the heater strip, the auxiliary repair insulating part is of an h shape, and comprises a supporting connecting portion, a first flange, a second flange and a third flange, the first flange, the second flange and the third flange perpendicularly extend out of the supporting connecting portion, the first flange and the second flange are coplanar, and extend in the direction opposite to the direction of the supporting connecting portion, the third flange is parallel to the first flange and the second flange, and is in the direction same as the direction of the second flange, and the deformed portion of the heater strip and the normal portion, adjacent to the deformed portion, of the heater strip are isolated by the portion, between the second flange and the third flange, of the supporting connecting portion. Therefore, when the heater strip deforms and needs repair, and an insulating part is damaged and falls off, the auxiliary repair insulating part is installed on the damaged portion of the heater strip, and it is ensured that the heater strip can be continuously used safely.
Description
technical field [0001] The invention relates to the technical field of integrated circuit manufacturing, and more specifically relates to a maintenance, installation and fixing structure and a maintenance, installation and fixing method for heating wire components of heat treatment equipment. Background technique [0002] In semiconductor heat treatment equipment, for example, vertical diffusion / oxidation furnace is one of the important process equipment semiconductors in the pre-process of integrated circuit production line. see figure 1 , figure 1 Shown is a partial structural schematic diagram of the prior art neutral heat treatment equipment. As shown in the figure, in the semiconductor process heat treatment equipment, the heat treatment device mainly includes the outer shell of the furnace body 1, the furnace body insulation layer 2, the reaction chamber 4 (tube) in the furnace body, and the wafer boat (boat) + wafer (wafer) 6 and insulation cylinder 5. The heating...
Claims
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Patent Timeline
Login to view more IPC IPC(8): H01L21/67
CPCH01L21/67098H01L21/67115
Inventor 孙少东董金卫赵燕平周厉颖
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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