Instant crispy pumpkin patches and preparation method thereof
A technology of noodles and pumpkin, which is applied in the field of instant pumpkin-flavored food and its production, can solve the problems of undiscovered pumpkin-flavored instant noodles, etc., and achieve the effects of improving immunity, increasing absorption rate, and crispy taste
CN103783401AInactive Publication Date: 2014-05-14ANHUI SCI & TECH UNIV
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- ANHUI SCI & TECH UNIV
- Publication Date
- 2014-05-14
- Estimated Expiration
- Not applicable · inactive patent
Abstract
The invention discloses instant crispy pumpkin patches and a preparation method thereof. The instant crispy pumpkin patches are prepared through the following raw materials in parts by mass: 500 parts of wheat powder, 50 to 100 parts of pumpkin without peel and flesh, 10 to 15 parts of pumpkin seeds, 40 to 60 parts of white sugar, 1 to 2 parts of table salt, and 5 to 8 parts of honey. The preparation method comprises the following steps: 1, steaming pumpkin, removing stalks with a filter screen to obtain pumpkin puree, adding water, and uniformly mixing to obtain a pumpkin puree mixed solution; 2, baking pumpkin seeds until ripping, and then crushing to reach the size like rice grains; 3, mixing and uniformly agitating raw materials, preparing paste, and then pressing into various small patches; 4, preparing iced flavored-water containing quality white sugar and table salt; 5, cooking the small patches, transferring to the iced flavored-water to completely cool, dipping in honey after completely cooling, then baking in a high-vacuum oven at temperature of 80 to 100 DEG C until showing faint yellow, and thus obtaining the crispy pumpkin patches. The instant crispy pumpkin patches have the advantages of being nutritional, healthy, instant to eat, and convenient.
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Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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