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Self-test system and method for wafer-level sensing element

A sensing element and testing system technology, applied in the direction of single semiconductor device testing, measuring devices, measuring electrical variables, etc., can solve problems such as difficulty in improving market competitiveness and inability to maximize output profits

Active Publication Date: 2017-11-10
KING YUAN ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, because of the need to use external measuring instruments, in the mass production stage, after considering the instrument cost and test time cost, the output profit will not be maximized and it will be difficult to improve market competitiveness

Method used

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  • Self-test system and method for wafer-level sensing element
  • Self-test system and method for wafer-level sensing element
  • Self-test system and method for wafer-level sensing element

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Embodiment Construction

[0050] In order to further explain the technical means and effects of the present invention to achieve the intended purpose of the invention, the self-test system and method for wafer-level sensing elements proposed according to the present invention will be described below in conjunction with the accompanying drawings and preferred embodiments. Its specific implementation, structure, feature and effect thereof are described in detail as follows.

[0051] In order to make the description of the present invention more detailed and complete, reference may be made to the attached drawings and various embodiments described below, and the same numbers in the drawings represent the same or similar elements. On the other hand, well-known elements and steps have not been described in the embodiments in order to avoid unnecessary limitations of the invention.

[0052] see Figure 1A , which is a schematic diagram of a self-test system 100 for wafer-level sensing devices according to an...

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Abstract

The invention relates to a self-test system and method for wafer-level sensing elements. The self-test system includes wafer-level sensing elements and test modules. The wafer-level sensing element includes a fixed unit and a movable unit, wherein a sensing capacitance is formed between the fixed unit and the movable unit. The test module is used for electrically connecting the wafer-level sensing element, and the test module includes a test circuit for measuring the sensing capacitance. Wherein, the wafer-level sensing element is used to receive an input signal to make the sensing capacitor generate a capacitance variation, and the test circuit outputs a test signal according to the capacitance variation.

Description

technical field [0001] The invention relates to a self-test system for wafer-level sensing elements, in particular to a self-test system for wafer-level sensing elements that can effectively reduce testing costs and improve detection efficiency. Background technique [0002] Nowadays, the application level of micro-electro-mechanical components is becoming more and more extensive, and the development of semiconductor technology is also becoming more and more mature, resulting in the price of micro-electro-mechanical components decreasing year by year, while the cost of component testing is difficult to reduce due to the high-priced testing machines required, making it impossible Effectively reduce the overall cost. [0003] Especially at present, when testing wafer-level components, external measuring instruments must be used in the testing process, and the micro-capacitance measurement of wafer-level structures of micro-electromechanical systems (MEMS) can be measured by me...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R35/00G01R31/26
Inventor 邱东梁叶人荣
Owner KING YUAN ELECTRONICS