Mortar nozzles for multi-wire cutting machines

Abstract

The invention provides a mortar nozzle used for a multi-wire cutting machine. The mortar nozzle comprises an outer pipe, an inner pipe, a fixing support seat, an outer pipe plug and an inner pipe plug, wherein the inner pipe is arranged in the outer pipe; the fixing support seat is used for fixing the outer pipe with the inner pipe; the outer pipe plug is mounted on the end part of the outer pipe; the inner pipe plug is mounted on the end part of the inner pipe; a nozzle seam is formed in the outer pipe along the axial direction of the outer pipe; a plurality of nozzle holes are formed in the inner pipe along the axial direction of the inner pipe; a nozzle interface which is communicated with the inner pipe is arranged on the fixing support seat. Mortar enters the inner pipe from the nozzle interface, leaves the inner pipe by the nozzle holes of the inner pipe to enter the outer pipe, and is finally injected from the nozzle seam of the outer pipe. In such a way, the mortar injected by the mortar nozzle can be uniformly sprinkled on steel wires, and the cutting requirement can be met without consuming much mortar. The mortar nozzle has the advantages that the usage amount of the mortar is reduced, the cutting capability of the steel wires does not decline, and the cost is reduced.

Description

technical field [0001] The invention relates to a silicon chip cutting device, in particular to a mortar nozzle for a multi-wire cutting machine. Background technique [0002] Today's traditional solar silicon wafer cutting is carried out by ordinary steel wire carrying a mortar mixed with silicon carbide and polyethylene glycol for grinding and cutting at high speed. In this process, in order to ensure that the cutting steel wire and mortar have sufficient cutting ability, the first condition is that the steel wire can carry sufficient mortar to participate in the cutting, and the mortar is evenly sprayed on the wire by the mortar nozzle. [0003] Under the increasingly severe cost pressure, major silicon wafer manufacturers are reducing the usage of auxiliary materials significantly. Multi-wire cutting machines mainly use steel wire, suspension, and mortar as auxiliary materials. In order to reduce costs, the steel wire used by various manufacturers has been greatly reduc...

AI Technical Summary

Problems solved by technology

However, the commonly used multi-wire cutting machine has great difficulties in reducing the amount of mortar used. Because the mortar flow rate supplied to the mortar nozzle fluctuates, the mortar sprayed by the mortar nozzle is not uniform enough, and the cutting ability of the steel wire is also reduced after the amount of mortar usage is reduced. Along with the decline, there are sometimes quality problems with the cut silicon wafers

Therefore, the commonly used multi-wire cutting machine cannot reduce the amount of mortar used while ensuring that the cutting ability does not decrease

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