Silicon wafer processing system and processing method

Abstract

The invention discloses a silicon chip processing system and a processing method thereof. The system comprises a process chamber, a transmission device and a control system. The control system comprises a process task setting module used for setting a process task for each silicon chip to be processed in a box in a chip chamber in the transmission device and setting a serial position number corresponding to each silicon chip in the process task, a process parameter reading module used for reading the corresponding process content parameter from the process chamber and selecting the corresponding process content parameter for each silicon chip in the process task, a transmission module used for setting a transmission path from the chip chamber to the process chamber for each silicon chip in the process task according to the serial position number and the process content parameter of each silicon chip in the process task and transmitting the silicon chip from the chip chamber to the process chamber to carry out processing. The overall efficiency of the silicon chip processing is raised.

Description

technical field [0001] The invention relates to the field of silicon wafer processing, in particular to a silicon wafer processing system and processing method. Background technique [0002] In the current semiconductor equipment manufacturing, the silicon wafer processing system includes a process chamber for processing silicon wafers, as well as a loadport for storing silicon wafers, and the silicon wafers in each process task (job) The wafers are placed in the cassette first, and then the cassette is placed in the cassette; the control system needs to transfer the wafers from the cassette to the transfer chamber during the process of processing the wafers according to the process tasks Indoor, and then transferred to the process chamber for process processing, that is, the silicon wafer is transferred to the process chamber through the silicon wafer transfer platform for process processing. [0003] Existing silicon wafer transfer platforms, generally, such as figure 1 ...

AI Technical Summary

Problems solved by technology

However, when multiple silicon wafers are transferred to the same process chamber, because no consideration is given to which silicon wafer enters the process chamber for processing, some silicon wafers occupy the transmission channel for a long time, thereby reducing the transmission efficiency and causing the silicon wafer process The processing procedure is cumbersome and not easy enough

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