A soft substrate light source module and its manufacturing method
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 苏州国科盈睿医疗科技有限公司
- Publication Date
- 2017-04-26
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Abstract
Description
technical field
[0001] The invention relates to the technical field of semiconductor lighting, in particular to a soft substrate light source module and a manufacturing method thereof. Background technique
[0002] The semiconductor light source module has the advantages of long life and power saving, so it is more and more used in the field of lighting.
[0003] Common semiconductor light source modules are mostly soft substrate light source modules. It is made by fixedly installing the light-emitting element on the soft substrate, and then installing the soft substrate on the heat dissipation component. Among them, the soft substrate is mainly made of an interconnected circuit copper layer for forming the upper surface, a heat dissipation copper layer for forming the lower surface, and a polymer flexible material arranged between the upper surface layer and the lower surface layer.
[0004] At present, when the soft substrate is installed on the heat dissipation componen...