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Circuit board

A technology of printed circuit board and conductive layer, which is applied in the direction of printed circuit, printed circuit, printed circuit manufacturing, etc., and can solve the problem of high cost of conductive adhesive

Inactive Publication Date: 2014-05-28
SCHOELLER ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] A problem with the known printed circuit boards is the fact that the use of conductive adhesives over large areas is costly

Method used

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Examples

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Embodiment Construction

[0019] The printed circuit board 1 shown in the drawing can be equipped with at least one electronic component 2 as intended. The illustrated component 2 is an integrated circuit 3 arranged on a metal sheet 4 . The sheet metal 4 serves on the one hand for the ground contact and, on the other hand, to dissipate heat from the power loss of the component 2 . Component 2 is also equipped with contact tongues 5 for electrical contacting of integrated circuit 3 .

[0020] figure 1 Furthermore, a heat conducting element 6 is shown, which here and preferably consists of metal, in particular copper. In principle, all materials with good thermal conductivity can be used here.

[0021] from according to figure 2 It can be seen from the diagram that the heat conducting element 6 is connected to the surface 8 of the planar printed circuit board body 9 via the boundary layer 7 . The printed circuit board body 9 is, as described above, a planar arrangement of one or more single layers,...

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PUM

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Abstract

The invention relates to a circuit board for populating with at least one electronic component 2, wherein at least one heat conducting element is provided, is connected to a surface 8 of a sheet-like circuit board body 9 by way of a boundary layer 7. The boundary layer consists in certain areas of an electrically non-conducting layer and in certain areas of an electrically conducting layer, the non-conducting layer 10 combining with the circuit board body 9 and the heat conducting element 6 to provide at least one receiving space 12 with a pocket-like volume for the conducting layer.

Description

technical field [0001] The invention relates to a printed circuit board according to claim 1 for equipping at least one electronic component and a method according to claim 11 for producing such a printed circuit board. Background technique [0002] Printed electronic circuits are known from the prior art, in which printed circuit boards are equipped with electronic components. Such printed circuit boards can consist of one or more single-layer glass-fibre-reinforced hardened epoxy resin plates which are copper-plated on one or both sides to form the conductor tracks. Such an arrangement consisting of one or more individual layers is referred to herein as a "printed circuit board body". [0003] Installed and operating printed circuit boards are subject to a high heat dissipation due to the relatively high power dissipation of the electronic components arranged thereon. In order to dissipate the heat resulting from the power loss, it is known to provide heat conducting ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/18H05K1/02H05K3/00H05K3/34
CPCH05K1/021H05K1/0215H05K1/0243H05K3/0061H05K3/3452H05K2201/066H05K2201/09063Y10T29/49144Y10T29/49155H05K1/0203H05K3/0011H05K3/10H05K3/303
Inventor J·H·贝克尔
Owner SCHOELLER ELECTRONICS