Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Pressure Sensor Chip

A pressure sensor and sensor technology, applied in the direction of measuring fluid pressure, instruments, and pressure difference measurement between multiple valves, to prevent stress concentration, reduce stress generation, and ensure pressure resistance

Inactive Publication Date: 2016-08-31
YAMATAKE HONEYWELL CO LTD
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, since the pressure sensor chip 1 is protected from excessive pressure Pover by having the recesses 10a, 10b for restricting the displacement of the central diaphragm 6 and the barrier diaphragms 5a, 5b, it cannot be avoided. Enlargement of shape

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Pressure Sensor Chip
  • Pressure Sensor Chip
  • Pressure Sensor Chip

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0044] Hereinafter, embodiments of the present invention will be described in detail based on the drawings.

[0045] [Embodiment 1]

[0046] figure 1 It is a schematic diagram showing the first embodiment (Embodiment 1) of the pressure sensor chip according to the present invention. In this figure, with Figure 12 same notation as with reference to Figure 12 The description of the members that are the same as or equivalent to those described will be omitted. In addition, in this embodiment, the pressure sensor chip is denoted by symbol 11A, and Figure 12 The pressure sensor chip 11 shown in the difference.

[0047] With this pressure sensor chip 11A, the stopper member 11-2 has a non-joint area SA inside that communicates with the peripheral portion of the pressure guide hole 11-2b. This non-joint area SA is provided on a part of the surface PL parallel to the pressure receiving surface of the sensor diaphragm 11-1. The non-joining area SA is formed by roughening the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

To provide a pressure sensor chip that reduces the stress generated by the restriction of the sensor diaphragm, prevents stress concentration on the edge of the diaphragm, and ensures the desired withstand voltage. In the stopper member (11-2), a part of the surface (PL) parallel to the pressure receiving surface of the sensor diaphragm (11-1) is provided with a non-joint area communicating with the periphery of the pressure guide hole (11-2b) (SA). For example, a stopper member (11-21) that will be partly divided into two parts by combining the surface (PL) provided with the non-joint area (SA) and the area (SB) removed from the non-joint area (SA) with each other And another part of the stop member (11‑22) is formed as a stop member (11‑2). Thus, the surface (PL) parallel to the pressure-receiving surface of the sensor diaphragm (11-1) is divided into a non-joint area SA that communicates with the circumference of the pressure guide hole (11-2b) and a non-joint area SA that does not communicate with the guide hole (11-2b). Bonding area (SB) at the periphery of the press hole (11‑2b).

Description

technical field [0001] The present invention relates to a pressure sensor chip using a sensor diaphragm that outputs a signal corresponding to the pressure difference received on one surface and the other surface. A pressure sensor chip that detects the pressure applied to the diaphragm by changes in the resistance value of the resistance strain gauge on the diaphragm. Background technique [0002] Conventionally, as a differential pressure sensor for industrial use, a differential pressure sensor incorporating a pressure sensor chip using a sensor diaphragm that outputs a signal corresponding to a pressure difference received on one surface and the other surface is used. In this differential pressure sensor, the measured pressures applied to the pressure-receiving diaphragms on the high-pressure side and the low-pressure side are guided to one surface and the other surface of the sensor diaphragm through the filling liquid as a pressure transmission medium, and the deformat...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01L9/04
CPCG01L9/0051G01L13/025G01L9/00G01L13/00G01L19/06
Inventor 德田智久濑户祐希
Owner YAMATAKE HONEYWELL CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com