Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

A substrate processing device and substrate technology, applied to each unit, substrate holding mechanism, substrate processing device, and substrate processing, various components or devices, can solve problems such as unstable pure water flow, and achieve improved response delay, Appropriate and reliable control, the effect of improving responsiveness

Active Publication Date: 2014-06-04
EBARA CORP
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the conventional structure, since one header supplies pure water to each grinding unit through a plurality of pipes, the flow r

Method used

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  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method
  • Substrate processing apparatus, substrate processing method, substrate holding mechanism, and substrate holding method

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Embodiment Construction

[0122] Hereinafter, embodiments of the substrate processing apparatus of the present invention will be described in detail with reference to the accompanying drawings. The same reference numerals are attached to the same or equivalent components, and overlapping descriptions thereof are omitted.

[0123] figure 1 It is a top view which shows the whole structure of the substrate processing apparatus which concerns on one Embodiment of this invention. like figure 1 As shown, this substrate processing apparatus has a substantially rectangular casing 1, and the interior of the casing 1 is partitioned into a load / unload unit 2, a polishing unit 3, and a cleaning unit 4 by partition walls 1a and 1b. The above-mentioned loading / unloading unit 2, grinding unit 3, and cleaning unit 4 are independently combined and exhausted independently. Further, the substrate processing apparatus includes a control unit 5 that controls the substrate processing operation.

[0124] The loading / unlo...

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Abstract

A substrate processing apparatus, a substrate processing method, a substrate holding mechanism, and a substrate holding method are disclosed. The apparatus includes a polishing section 3 configured to polish a substrate W, a transfer mechanism 5, 6 configured to transfer the substrate, and a cleaning section 4 configured to clean and dry the polished substrate W. The cleaning section 4 has plural cleaning lines for cleaning plural substrates. The plural cleaning lines have plural cleaning modules 201A, 201B, 202A, 202B and plural transfer robots 209, 210 for transferring the substrates.

Description

[0001] This application is a divisional application of the original application whose filing date is June 4, 2009, the application number is 200910141394.1, and the invention title is "Substrate Processing Device and Method, Substrate Holding Mechanism, and Substrate Holding Method". technical field [0002] The present invention relates to a substrate processing apparatus and a substrate processing method, and more particularly, to a substrate processing apparatus and a substrate processing method used when polishing a substrate such as a semiconductor wafer or the like to be flat. [0003] In addition, the present invention relates to a substrate holding mechanism and a substrate holding method, and more particularly, to a substrate holding mechanism suitable for a cleaning apparatus or a drying apparatus incorporated in a substrate such as a semiconductor wafer. [0004] Furthermore, the present invention also relates to each unit, various components or apparatuses used in t...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCB24B37/345H01L21/67219H01L21/67742H01L21/67754
Inventor 宫崎充胜冈诚司松田尚起国泽淳次小林贤一外崎宏筱崎弘行锅谷治森泽伸哉小川贵弘牧野夏木
Owner EBARA CORP
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