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Tight focus spot energy optimization method and device for femtosecond laser three-dimensional micromachining

A femtosecond laser, energy optimization technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as lack of accuracy, and achieve the effects of simple installation, adjustable laser space energy distribution, and simple principle.

Inactive Publication Date: 2016-03-30
BEIJING UNIV OF TECH
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

As a result, the processed structure often cannot achieve good precision in the Z direction.

Method used

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  • Tight focus spot energy optimization method and device for femtosecond laser three-dimensional micromachining
  • Tight focus spot energy optimization method and device for femtosecond laser three-dimensional micromachining
  • Tight focus spot energy optimization method and device for femtosecond laser three-dimensional micromachining

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Embodiment Construction

[0029] The tightly focused spot energy optimization method for femtosecond laser three-dimensional micromachining of the present invention comprises:

[0030] Step 1, the femtosecond laser generates a femtosecond laser beam, and the femtosecond laser beam is reflected by the first reflector to the surface of the attenuation sheet to attenuate the laser energy;

[0031] Step 2: Control the diameter of the spot through the aperture, measure the average power of the femtosecond laser beam with a laser power meter, and adjust the average power by rotating the attenuation sheet; finally modulate the femtosecond laser beam through the beam energy conversion system Laser beam to obtain the required central energy attenuation spot;

[0032] Step 3, the central attenuated light obtained in step 2 is introduced into the microfocus system through the second mirror, and after passing through the microfocus system, a focused spot is generated inside the sample;

[0033] Step 4, write the ...

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Abstract

The invention provides a method and device for optimizing tight focusing light spot energy of femtosecond laser three-dimensional micromachining. The method comprises the steps that firstly, a femtosecond laser produces a femtosecond laser beam which is reflected through a first reflector to the surface of an attenuation sheet to attenuate the laser energy; secondly, the diameter of a light spot is controlled through a diaphragm, the average power of the femtosecond laser beam is measured through a laser power meter, the average power is adjusted by rotating the attenuation sheet, and the femtosecond laser beam is modulated through a beam energy converting system; thirdly, center attenuation light is guided into a microscopy focusing system through a second reflector to be focused, and then a focused light spot is produced inside a sample; fourthly, a motion control algorithm is compiled according to the laser machining motion track and is input into a computer, the computer sends an order to a stepping motor control box, the stepping motor control box controls a three-dimensional electric displacement platform to move in the sample according to the needed motion track to achieve three-axis movement, and the three-dimensional machining is finally achieved through the focused femtosecond laser.

Description

technical field [0001] The invention belongs to the field of femtosecond laser application technology and laser micromachining technology, and in particular relates to a tightly focused spot energy optimization method and device for femtosecond laser three-dimensional micromachining. Background technique [0002] Femtosecond laser three-dimensional micromachining technology is an important research content of precision micromachining research. At present, many cutting-edge scientific progress and high-tech breakthroughs are derived from the improvement of microstructure processing precision. With the rapid development of femtosecond laser micromachining technology, femtosecond laser micromachining technology has been widely used in micro-total analysis system (μ-TAS), micro-electromechanical system (MAMS), micro-reactor (Micro-reactor), micro-optics components etc. Among them, the transformation from two-dimensional surface processing to three-dimensional space processing ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/046
CPCB23K26/046
Inventor 陈涛郑崇刘世炳谷鹏刘嵩
Owner BEIJING UNIV OF TECH
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