Heat exchange tray used for laminator

A technology of heat exchange disk and laminator, applied in the field of heat exchange disk, can solve the problems of high maintenance cost of support rods and plugs, space occupied by support rods, long maintenance time, etc., to ensure cooling/heating effect and easy maintenance. , the effect of reducing maintenance costs

Active Publication Date: 2014-06-18
SHENNAN CIRCUITS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] The purpose of the embodiments of the present invention is to provide a heat exchange plate for a laminator, which aims to solve the problem in the prior art that the flow of heat exchange liquid in the pipeline is insufficient under the condition that the pump water pressure output is equal The resulting pipeline blockage, support rods occupying the space in the pipeline, resulting in flow reduction and pipeline blockage, high maintenance costs and long maintenance time due to damage to support rods and plugs

Method used

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  • Heat exchange tray used for laminator
  • Heat exchange tray used for laminator
  • Heat exchange tray used for laminator

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Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention more clear, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] see Figure 4 and Figure 5 , the heat exchange disc 20 provided by the embodiment of the present invention is used in a lamination machine. The heat exchange tray 20 includes a tray body 21 and a plurality of first fasteners 30 and a plurality of second fasteners 40 installed on the tray body 21 .

[0032] The tray body 21 has an upper surface 22 , a lower surface 23 opposite to the upper surface 22 , and four sides connecting the upper surface 22 and the lower surface 23 . The four sides include two opposite first sides 24 extending in the length direction of the tray body 21 and two...

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Abstract

The invention provides a heat exchange tray. The heat exchange tray comprises a tray body, and first fasteners and second fasteners mounted on the tray body; the tray body is provided with a group of channels penetrating through two opposite first side surfaces, and the tray body is provided with two flow channels penetrating through two opposite second side surfaces; the flow channels and the group of channels are arranged in an intersected manner; the group channels comprise two first channels positioned at two opposite outer sides of the group of channels, and second channels positioned between the two first channels; and two opposite ends of each of the flow channels are plugged through one of the first fasteners, two opposite ends of each of the second channels are plugged through one of the first fasteners, one of the ends of each of the first channels is plugged through one of the first fasteners, and the two flow channels positioned between the group of the channels are alternatively plugged through the second fasteners in order to form a bent pipeline for a heat exchange liquid to flow through in the tray body. The flow capacity of the heat exchange liquid increases under a same pumped hydraulic output condition, and the second fasteners are used to plug the flow channels, so the flow of the heat exchange liquid is smooth, the maintenance of the tray is convenient, and the maintenance cost is reduced.

Description

technical field [0001] The present invention relates to a heat exchange disc for a laminator. Background technique [0002] see figure 1 , the existing heat exchange plate 10 is a large and thick steel plate with sufficient strength to open a curved and connected channel 11, so that the heat exchange liquid (for example, water) can circulate inside the channel 11 to ensure that the entire steel plate is always In low temperature or high temperature state. Please also see figure 2 , in actual use, the product 13 to be cooled / heated is placed between the heat exchange plates 10, and the product 13 itself is in a high temperature (about 100°C) or low temperature state before being put into the gap between multiple heat exchange plates 10 , after the product 13 is put into the gap between a plurality of heat exchange discs 10, because the heat exchange disc 10 continues at low temperature or high temperature, the product 13 is rapidly cooled / heated through the heat exchange ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C43/52
Inventor 王双林李浩罗亿龙张家虎阳正华王成勇
Owner SHENNAN CIRCUITS
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