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A kind of led filament and illuminator

A technology of LED filament and LED chip, which is applied in the field of lighting, can solve the problems of blue leakage of LED filament, and achieve the effect of solving blue leakage and excellent lighting effect

Inactive Publication Date: 2017-08-25
SHENZHEN REFOND OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiment of the present invention is to provide an LED filament, aiming to solve the problem of blue leakage in the existing LED filament

Method used

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  • A kind of led filament and illuminator
  • A kind of led filament and illuminator
  • A kind of led filament and illuminator

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Embodiment Construction

[0015] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0016] In the embodiment of the present invention, the crystal-bonding area is set on the metal frame, and a plastic part is provided at each end of the crystal-bonding area to resist the overflow of the liquid fluorescent glue. After the liquid fluorescent glue is cured, it wraps the part where the crystal-bonding area is located. Metal skeleton, so that the light emitted by the LED chip located in the crystal-bonding area excites the surrounding fluorescent glue to produce light of the required color, thereby solving the problem of blue leakage of the LED filament.

[0017] The implementation of ...

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Abstract

An LED filament and an illuminator using the LED filament. The LED filament comprises a metal framework (1) and a fluorescent adhesive (2). A middle part of the metal framework (1) is a die bonding area (11). Multiple LED chips (3) are arranged in the die bonding area (11). Two ends of the die bonding area (11) are respectively provided with a plastic element (4) used for preventing the liquid-form fluorescent adhesive (2) from overflowing. The liquid-form fluorescent adhesive (2), after cured, coats a part of the metal framework where the die bonding area (11) is located. Light emitted by the LED chips in the die bonding area excites the surrounding fluorescent adhesive to generate light of a required color, thereby solving a blue leakage problem of the LED filament. The LED filament can be applied in various illuminators.

Description

technical field [0001] The invention belongs to the technical field of illumination, and in particular relates to an LED filament and an illuminator. Background technique [0002] At present, LED filament light source products mainly form circuit boards on transparent ceramic or glass substrates, so as to achieve the purpose of emitting light at a large angle. However, transparent ceramics and glass substrates are expensive, complicated to manufacture, low in thermal conductivity, and generally use less than 1W of power, and the finished package cannot fundamentally solve the problem of blue leakage. Contents of the invention [0003] The purpose of the embodiments of the present invention is to provide an LED filament, aiming at solving the problem of blue leakage in the existing LED filament. [0004] The embodiment of the present invention is realized in this way, an LED filament includes a metal skeleton and fluorescent glue, the middle part of the metal skeleton is a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L25/075H01L33/48H01L33/50
CPCH01L25/0753H01L33/50H01L2924/0002
Inventor 游志裴小明
Owner SHENZHEN REFOND OPTOELECTRONICS