2results about How to "Solve pressure" patented technology

The invention provides a stator welding system and method with a tensioning function, and relates to the technical field of motor manufacturing, the system comprises a squirrel cage tensioning jig, a rotary driving mechanism, a lifting mechanism, an upper pressure head mechanism and a welding dust removal unit, according to the squirrel cage tensioning jig, arc-shaped tensioning modules distributed in the circumferential direction are synchronously driven by a driving module to move in the radial direction, a stator formed by splicing split iron cores is actively tensioned from the outer side, and the stator preforming function and the welding positioning function are integrated. Automatic feeding and discharging, tensioning, rotary welding and dust removal of the stator are achieved, the problems that a traditional welding mode is high in product tolerance requirement, tedious in procedure, poor in dust removal effect, prone to pipeline winding and the like are effectively solved, production efficiency and welding quality are remarkably improved, and compatibility of stators of different sizes is enhanced.

The invention relates to a ceramic-packaged digital isolator product structure and a chip isolation structure manufacturing method, the digital isolator product structure aims at solving the high-voltage isolation problem of a ceramic-packaged digital isolator and improving the reliability of the ceramic-packaged digital isolator, and the digital isolator product structure comprises a digital isolator chip and a shell, the substrate of the digital isolator chip is a semiconductor silicon wafer, and meanwhile, the digital isolator chip is provided with metal pressure bonding pads at the input end and the output end of the receiver chip and the transmitter chip; and the shell and the digital isolator chip are provided with insulating glue. In the digital isolator product structure provided by the invention, only the PAD spacing of the chips for designing the isolator is increased, so that the problem of voltage resistance between the input end and the output end of the isolator manufactured by the existing semiconductor silicon wafer process is solved; and meanwhile, the insufficiency of insulation and voltage resistance of the digital isolator manufactured by the semiconductor silicon wafer process can be solved by adopting the existing silicon wafer process line and chip.