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A reciprocating bending machine for circuit board layering

A circuit board and bending machine technology, applied in the direction of layered products, lamination, lamination auxiliary operations, etc., can solve the problems of PCB layering, circuit boards cannot be layered, etc., to achieve good reliability, simple structure, Easy to set effects

Active Publication Date: 2015-09-30
NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006]2. See Figure 1, no matter how many times of rolling, the mouth (B) of the PCB cannot be delaminated;
[0007]3. See Figure 2, there are usually hundreds or even thousands of sockets (C) on a PCB board. These sockets are similar to rivets to rivet the PCB, and the circuit boards around the sockets cannot be layered.

Method used

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  • A reciprocating bending machine for circuit board layering
  • A reciprocating bending machine for circuit board layering
  • A reciprocating bending machine for circuit board layering

Examples

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Effect test

Embodiment 1

[0036] Such as Figure 3 to Figure 8 As shown, the reciprocating bending machine 3 of the present invention is mainly composed of a feed mechanism, a fixed backing plate 31, a pressing plate 32, an upper bending plate 33, a lower bending plate 34, a cam driving device, a bending plate slide bar 36, and a pressing plate slide Rod 37, frame 38, insulation layer 39 and corresponding induction switch or travel switch, electric control system etc. are formed. The fixed backing plate 31 is fixed on the frame 38 . The pressing plate 32 can move along the pressing plate slide bar 37 . The upper curved plate 33 and the lower curved plate 34 can move along the curved plate slide bar 36; the action information of the feed mechanism is collected by the corresponding induction switch or travel switch, and their action coordination is completed by the electrical control system. The pressing plate 32 , the upper curved plate 33 and the lower curved plate 34 are all driven by the cam driv...

Embodiment 2

[0044] This example provides a method of using the reciprocating bending machine in Example 1 to bend a circuit board (reciprocating bending method or bending split-layer method). Each feed is L (L=3mm), and the thickness of each layer in the circuit board is a(a=0.2 mm), see Figure 9 , when it is bent by compression, such as Figure 10 phenomenon, the inner and outer layers will be forced to stagger by H (H=1.884), and the adjacent two layers will also be staggered by h (h=0.314), h=(a×Π)÷2, we will The stagger amount h divided by the feed rate L is called the stagger degree of two adjacent layers, and expressed in d, then d=h / L, when the stagger degree d is sufficiently greater than the elongation of the material itself, the two adjacent layers The staggering force will overcome the bonding force between them and produce staggering. The circuit board is made of multi-layer glass fiber cloth, and the elongation of the glass fiber cloth is less than 0.3% at 180 degrees. ...

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PUM

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Abstract

The invention relates to a reciprocating bending machine for layering a circuit board. The reciprocating bending machine comprises a rack, and a bending mechanism arranged on the rack, wherein the bending mechanism comprises a fixed base plate arranged on the rack, a pressing plate arranged above the fixed base plate, an upper bending plate arranged in front of the pressing plate, and a lower bending plate arranged below the upper bending plate; the pressing plate, the upper bending plate and the lower bending plate respectively can move along the up and down direction in a reciprocating manner; the bending mechanism also comprises a cam drive device for driving the pressing plate, the upper bending plate and the lower bending plate to move in the reciprocating manner. By adopting the reciprocating bending machine, the circuit board can be effectively layered and peeled off, and the work reliability is good.

Description

technical field [0001] The invention relates to a reciprocating bending machine for delamination of circuit boards. Background technique [0002] With the advancement of science and technology and the shortening of the replacement cycle of electronic products, electronic waste is growing at an annual rate of more than 20%, becoming the fastest growing waste in the world. According to relevant data, currently the world produces more than 50 million tons of electronic waste every year, 70% of which are discarded in China through various means, while my country produced more than 2.3 million tons of electronic waste in 2007. If such a huge amount of electronic waste is not handled properly, it will cause environmental pollution comparable to natural disasters. If it is handled properly, not only will it not cause environmental pollution, but also a large amount of precious metal resources can be recovered from it, which is also very beneficial to the rapid development of electr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B38/10
Inventor 黄海马永梅
Owner NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECH