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A kind of reciprocating bending machine for circuit board layering and its application

A circuit board and bending machine technology, applied in the direction of layered products, lamination, lamination auxiliary operations, etc., can solve the problems of inability to delaminate the PCB, the circuit board cannot be delaminated, etc., to achieve easy separation, simple structure, and easy setting. handy effect

Active Publication Date: 2015-09-30
NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006]2. See Figure 1, no matter how many times of rolling, the mouth (B) of the PCB cannot be delaminated;
[0007]3. See Figure 2, there are usually hundreds or even thousands of sockets (C) on a PCB board. These sockets are similar to rivets to rivet the PCB, and the circuit board around the socket cannot be layered.

Method used

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  • A kind of reciprocating bending machine for circuit board layering and its application
  • A kind of reciprocating bending machine for circuit board layering and its application
  • A kind of reciprocating bending machine for circuit board layering and its application

Examples

Experimental program
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Effect test

Embodiment 1

[0032] This example provides a reciprocating bending machine. Such as Figure 3 to Figure 5 As shown, the reciprocating bending machine 3 of the present invention is mainly composed of a feed mechanism, a fixed backing plate 31, a pressing plate 32, an upper bending plate 33, a lower bending plate 34, a cylinder (comprising a pressing cylinder 35a, an upper bending cylinder 35b, a lower bending Bending cylinder 35c), bending plate slide bar 36, pressing plate slide bar 37, frame 38, insulation layer 39 and corresponding induction switch or stroke switch, electric control system etc. composition. The feeding mechanism includes a pair of feeding rollers 30a, a stepping motor or a servo motor for driving the feeding rollers 30a. The fixed backing plate 31 is fixed on the frame 38; the pressing plate 32 can move along the pressing plate slide bar 37, controlled by the pressing cylinder 35a; the upper bending plate 33 can move along the bending plate sliding bar 36, controlled b...

Embodiment 2

[0039] This example provides a method for bending a circuit board by using the reciprocating bending machine in Example 1 (reciprocating bending method or bending split-layer method). Each feed rate is L (L=3mm), and the thickness of each layer in the circuit board is a(a=0.2 mm), see Figure 7 , when it is bent by compression, such as Figure 8 phenomenon, the inner and outer layers will be forced to stagger by H (H=1.884), and the adjacent two layers will also be staggered by h (h=0.314), h=(a×Π)÷2, we will The stagger amount h divided by the feed rate L is called the stagger degree of two adjacent layers, and expressed in d, then d=h / L, when the stagger degree d is sufficiently greater than the elongation of the material itself, the two adjacent layers The staggering force will overcome the bonding force between them and produce staggering. The circuit board is made of multi-layer glass fiber cloth, and the elongation of the glass fiber cloth is less than 0.3% at 180 de...

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PUM

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Abstract

The invention relates to a reciprocating bending machine for layering circuit boards. The reciprocating bending machine comprises a stander and a bending mechanism arranged on the stander. The reciprocating bending machine is characterized in that the bending mechanism comprises a fixed gasket, a compression plate, an upper bending plate, a lower bending plate, a compression air cylinder, an upper bending air cylinder and a lower air cylinder, wherein the fixed gasket is arranged on the stander, the compression plate is located above the fixed gasket, the upper bending plate is located in front of the compression plate, the lower bending plate is located below the upper bending plate; the compression plate, the upper bending plate and the lower bending plate can respectively do a reciprocating motion along the longitudinal direction, and the compression air cylinder, the upper bending air cylinder and the lower air cylinder are used for respectively driving the compression plate, the upper bending plate and the lower bending plate to do the reciprocating motion. The reciprocating bending machine further comprises a sensing switch or a travel switch and an electrical apparatus control system, wherein the sensing switch or the travel switch is used for collecting action information of each air cylinder. According to the reciprocating bending machine, two layers of adjacent circuit boards can be effectively separated, and a glass fabric and rivets can be easily separated, so that the circuit boards can be effectively layered and stripped; besides, the reciprocating bending machine is simple in structure and is convenient to arrange.

Description

technical field [0001] The invention relates to a reciprocating bending machine for circuit board delamination and its application. Background technique [0002] With the advancement of science and technology and the shortening of the replacement cycle of electronic products, electronic waste is growing at an annual rate of more than 20%, becoming the fastest growing waste in the world. According to relevant data, currently the world produces more than 50 million tons of electronic waste every year, 70% of which are discarded in China through various means, while my country produced more than 2.3 million tons of electronic waste in 2007. If such a huge amount of electronic waste is not handled properly, it will cause environmental pollution comparable to natural disasters. If it is handled properly, not only will it not cause environmental pollution, but also a large amount of precious metal resources can be recovered from it, which is also very beneficial to the rapid devel...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B38/10B09B3/00
CPCY02W30/82
Inventor 黄海马永梅
Owner NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECH