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Reciprocating bending machine for layering circuit boards

A technology for circuit boards and bending machines, applied in metal processing equipment, feeding devices, positioning devices, etc., can solve the problems of inability to delaminate PCBs and circuit boards, and achieve good reliability, simple structure, and easy installation convenient effect

Active Publication Date: 2014-07-09
NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006]2. See Figure 1, no matter how many times of rolling, the mouth (B) of the PCB cannot be delaminated;
[0007]3. See Figure 2, there are usually hundreds or even thousands of jacks (C) on a PCB board. These jacks are similar to rivets to rivet the PCB, and the circuit boards around the jacks cannot be layered.

Method used

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  • Reciprocating bending machine for layering circuit boards
  • Reciprocating bending machine for layering circuit boards
  • Reciprocating bending machine for layering circuit boards

Examples

Experimental program
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Embodiment 1

[0036] like Figure 3 to Figure 8 As shown, the reciprocating bending machine 3 of the present invention is mainly composed of a feed mechanism, a fixed backing plate 31, a pressing plate 32, an upper bending plate 33, a lower bending plate 34, a driving device, a bending plate slide bar 36, and a pressing plate slide bar 37. The frame 38, the insulation layer 39 and the corresponding induction switch or travel switch, electrical control system and so on. The driving device comprises a cam driving device and a compression cylinder 351 . The fixed backing plate 31 is fixed on the frame 38 . The pressing plate 32 can move along the pressing plate slide bar 37 . The upper curved plate 33 and the lower curved plate 34 can move along the curved plate slide bar 36 . The action information of the feed mechanism and each cylinder is collected by the corresponding induction switch or travel switch, and their action coordination is completed by the electrical control system. The p...

Embodiment 2

[0044] This example provides a method for bending a circuit board by using the reciprocating bending machine in Example 1 (reciprocating bending method or bending split-layer method). Each feed rate is L (L=3mm), and the thickness of each layer in the circuit board is a(a=0.2 mm), see Figure 9 , when it is bent by compression, such as Figure 10 phenomenon, the inner and outer layers will be forced to stagger by H (H=1.884), and the adjacent two layers will also be staggered by h (h=0.314), h=(a×Π)÷2, we will The stagger amount h divided by the feed rate L is called the stagger degree of two adjacent layers, and expressed in d, then d=h / L, when the stagger degree d is sufficiently greater than the elongation of the material itself, the two adjacent layers The staggering force will overcome the bonding force between them and produce staggering. The circuit board is made of multi-layer glass fiber cloth, and the elongation of the glass fiber cloth is less than 0.3% at 180 d...

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PUM

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Abstract

The invention relates to a reciprocating bending machine for layering circuit boards. The reciprocating bending machine comprises a frame and a bending mechanism. The bending mechanism comprises a fixing subplate, a pressing plate, an upper bending plate and a lower bending plate. The fixing subplate is arranged on the frame, the pressing plate is located above the fixing subplate, the upper bending plate is located ahead of the pressing plate, and the lower bending plate is located under the upper bending plate. The pressing plate, the upper bending plate and the lower bending plate can respectively vertically move in a reciprocating manner. The bending mechanism further comprises a pressing air cylinder, a cam driving device and an electronic control system, wherein the pressing air cylinder is used for driving the pressing plate to move in a reciprocating manner, the cam driving device is used for driving the upper bending plate and the lower bending plate to move in a reciprocating manner, and the electronic control system is used for controlling the pressing air cylinder to move. By the arrangement, the circuit boards can be layered and stripped, and the reciprocating bending machine is simple in setting and good in reliability.

Description

technical field [0001] The invention relates to a reciprocating bending machine for delamination of circuit boards. Background technique [0002] With the advancement of science and technology and the shortening of the replacement cycle of electronic products, electronic waste is growing at an annual rate of more than 20%, becoming the fastest growing waste in the world. According to relevant data, currently the world produces more than 50 million tons of electronic waste every year, 70% of which are discarded in China through various means, while my country produced more than 2.3 million tons of electronic waste in 2007. If such a huge amount of electronic waste is not handled properly, it will cause environmental pollution comparable to natural disasters. If it is handled properly, not only will it not cause environmental pollution, but also a large amount of precious metal resources can be recovered from it, which is also very beneficial to the rapid development of ele...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21D5/04B21D43/09
Inventor 黄海马永梅
Owner NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECH