Dry etching machine and lower electrode of dry etching machine

Abstract

The invention relates to a dry etching machine and a lower electrode of the dry etching machine. The dry etching machine is used for conducting dry etching treatment on a substrate. The dry etching machine comprises an upper electrode and the lower electrode which is arranged opposite to the upper electrode. A plurality of salient points are formed on the upper surface used for bearing the substrate of the lower electrode, the salient points are arranged around the upper surface of the lower electrode, or the salient points are arranged on the upper surface of the lower electrode in a crossed shape or in a shape like a Chinese character 'tian'. By means of the dry etching machine and the lower electrode of the dry etching machine, the substrate sticking phenomenon can be avoided, cooling can be effectively achieved, meanwhile, salient point ripples are avoided, and therefore the percent of pass of products is improved.

Description

technical field [0001] The application relates to a dry etching machine and a lower electrode of the dry etching machine. Background technique [0002] The lower electrode used to carry the substrate (for example, glass substrate) to be dry-etched in the existing dry etching machine is usually a flat bottom electrode, but after a period of use, the flat bottom electrode will be damaged due to surface wear Causes a transient vacuum phenomenon between the lower electrode and the substrate carried on it, which in turn causes substrate damage, i.e., chipping, due to the adhesion of the lower electrode to the substrate (i.e., chipping) when the pin is lifted to remove the processed substrate Phenomenon. Moreover, the abnormality of the substrate transfer process will lead to scrapping of normal products due to scratches and residual defects, thereby reducing product productivity and increasing labor costs. [0003] In order to avoid the above fragmentation phenomenon, an emboss...

AI Technical Summary

Problems solved by technology

[0004] But although the lower electrode 12 of this bump type can improve the fragmentation phenomenon and effectively cool down, the following problems still exist: as image 3 As shown, usually after the substrate 13 is etched, the substrate 13 will be thinned in order to make the product conform to the rule of lightness, thinness and shortness. Stress concentration is formed where the bumps 101 contact, and then emboss mura 14 in a checkerboard matrix is ​​generated on the substrate 13, which will affect the yield of the product

Images