Manufacturing method of circuit board carrying large current and circuit board carrying large current
A manufacturing method and circuit board technology are applied in the directions of printed circuits connected with non-printed electrical components, multi-layer circuit manufacturing, assembling printed circuits with electrical components, etc., and can solve the problems of difficult assembly and miniaturization of electronic products, etc. Achieve the effect of avoiding long-term exposure, improving quality and longevity, and simplifying wiring
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Embodiment 1
[0046] Such as figure 1 As shown, the present invention provides a method for manufacturing a circuit board carrying a large current, comprising:
[0047] 101. Open a first receiving groove on the core board.
[0048] The step of opening the first receiving groove on the core board may include: Figure 2a As shown, a first receiving groove 203 penetrating through the core board 201 is opened on the core board 201 . That is, the first receiving groove 203 is a hollow groove. A circuit layer 202 is provided on the surface of the core board 201 .
[0049] The step of opening a first receiving groove on the core board may further include: opening a first receiving groove not penetrating the core board on the core board. The bottom and periphery of the first receiving groove are located in the core board.
[0050] 102. If Figure 2b As shown, the conductive block 204 is inserted into the first receiving groove 203 , and the conductive block 204 is exposed from the first recei...
Embodiment 2
[0060] Such as image 3 As shown, the embodiment of the present invention provides a method for manufacturing a circuit board carrying a large current, including:
[0061] 301. If Figure 4a As shown, a first accommodating groove 403 penetrating through the core board 401 is opened on the core board 401 .
[0062] The first receiving groove 403 is a hollow groove. A circuit layer 402 is provided on the surface of the core board 401 .
[0063] 302. If Figure 4b As shown, the conductive block 404 passes through the first receiving groove 403, the first end of the conductive block 404 exposes the first notch 405 above the first receiving groove, the second of the conductive block The end portion exposes the second notch 406 below the first receiving groove, and the first end portion is opposite to the second end portion.
[0064] In step 302, the height of the conductive block 404 is greater than the thickness of the core board, and two ends of the conductive block 404 are ...
Embodiment 3
[0072] Such as Figure 5 As shown, this embodiment provides a method for manufacturing a circuit board carrying a large current, including:
[0073] 501. such as Figure 6a As shown, a hollow groove 602 penetrating through the core board is provided on the core board 601 . The hollow groove 602 is used to accommodate the conductive block.
[0074] 502. Embedding a conductive block in the hollow groove, the thickness of the conductive block is less than or equal to the thickness of the core board.
[0075] Such as Figure 6b As shown, the conductive block 603 is embedded in the hollow groove 602 , and the upper and lower ends of the conductive block are respectively flush with the circuit layer 604 on the upper and lower surfaces of the core board 601 . The hollow groove can completely accommodate the conductive block. The conductive block may be a metal block such as a copper block.
[0076] 503. such as Figure 6c As shown, after the conductive block 603 is embedded in...
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