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Heat-dissipation module

A heat dissipation module and heat sink technology, which is applied in cooling/ventilation/heating transformation, instruments, electrical digital data processing, etc., can solve the problems of poor heat dissipation, large space, and not suitable for light and thin computer equipment, and achieve saving Good effect of space and heat dissipation

Inactive Publication Date: 2014-07-02
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] The traditional computer cooling module includes a radiator and a fan installed on the radiator. However, the traditional cooling module occupies a large space and is not suitable for thin and light computer equipment (such as notebook computers or tablet computers). computer)
If the fan is omitted and the radiator is directly used to dissipate heat, it will lead to poor heat dissipation

Method used

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Examples

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Embodiment Construction

[0021] see Figure 1 to Figure 2 , in a preferred embodiment of the present invention, a heat dissipation module includes a heat sink 10, a bottom plate 20, a circuit board 30, a bearing 40, a mounting part 50, a fan impeller 60 and a main cover 70 .

[0022] The heat sink 10 is circular and made of metal material with better thermal conductivity, which can be used to directly contact the heat source and take away the heat generated by the heat source.

[0023] A circular opening 22 is defined in the middle of the bottom plate 20 for installing the heat sink 10 , and the heat sink can be installed and fixed in the circular opening 22 . The bottom plate 20 also defines a plurality of vents 24 around the circular opening 22 . A first blocking piece 261 and a second blocking piece 263 are disposed on the edge of the bottom plate 20 , both of the first blocking piece 261 and the second blocking piece 263 are n-shaped and perpendicular to the bottom plate 20 .

[0024] A circula...

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PUM

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Abstract

A heat dissipation module includes an encasing structure, a fan impeller mounted in the encasing structure, a heat dissipation piece, and a bearing. The fan impeller includes a mounting post and a plurality of fan blades surrounding the post. The heat dissipation piece is mounted in a base plate of the encasing structure and configured for directly contacting with a heat generating component. The bearing is mounted on the heat dissipation piece. The mounting post is pivotably mounted in the bearing. The fan impeller is capable of dissipating heat generated by the heat generating component when the mounting post is rotating in the bearing.

Description

technical field [0001] The invention relates to a cooling module. Background technique [0002] The traditional computer cooling module includes a radiator and a fan installed on the radiator. However, the traditional cooling module occupies a large space and is not suitable for thin and light computer equipment (such as notebook computers or tablet computers). computer). If the fan is omitted and the radiator is directly used to dissipate heat, it will lead to poor heat dissipation. Contents of the invention [0003] In view of the above, it is necessary to provide a heat dissipation module with good heat dissipation effect and space saving. [0004] A heat dissipation module, comprising a housing and a fan impeller installed in the housing, the housing is equipped with a heat sink for direct contact with heating elements and a bearing mounted on the heat sink, the The fan impeller includes a mounting column pivotally installed in the bearing and a plurality of fan bla...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20G06F1/20
CPCG06F1/203H05K7/20409
Inventor 曾祥鲲史宝权
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD