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Method for predicting the properties of resin molded article

A technology of resin molding and prediction method, which is applied in the field of predicting the physical properties of resin molding products, can solve problems such as resin cracking, and achieve high analysis accuracy and simple prediction effects

Inactive Publication Date: 2014-07-09
POLYPLASTICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, depending on the magnitude of the stress, the resin 10B may be cracked

Method used

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  • Method for predicting the properties of resin molded article
  • Method for predicting the properties of resin molded article
  • Method for predicting the properties of resin molded article

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0073] use Figure 9 The resin molded product 1 having the shape shown is referred to as a resin molded product. The material of the resin molded product is polyacetal resin, which is the same as that used in the above "creation of preliminary data".

[0074] First, thermal conductivity analysis was performed on the above-mentioned resin molded article 1 . The conditions of the heat conduction analysis are the same as those described above in "Creation of Preliminary Data". exist Figure 10 , represents the temperature distribution of one cross-section of the resin molded product 1 after the heat conduction analysis. Then, according to Figure 10 From the temperature distribution shown, the specific direction of the resin molded product 1 ( Figure 9 The relationship between the position of the X direction) and the integral value of the temperature of the resin molded product in this specific direction.

[0075]Then, the mold shrinkage rate of the resin molded product 1 ...

Embodiment 2

[0079] use Figure 12 The resin molded product 2 having the shape shown is a resin molded product. The material of the resin molded product is polyacetal resin, which is the same as that used in the above "creation of preliminary data".

[0080] First, thermal conductivity analysis was performed on the above-mentioned resin molded product 2 . The conditions of the heat conduction analysis are the same as those described above in "Creation of Preliminary Data". Then, based on the temperature distribution obtained by thermal conductivity analysis, the specific direction ( Figure 12 The relationship between the position of the X direction) and the integral value of the temperature of the resin molded product in this specific direction.

[0081] Then, the mold shrinkage rate of the resin molded product 1 is predicted by referring to the correspondence established in advance in the above "creation of preliminary data". exist Figure 13 The results are shown in . E.g Figure...

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Abstract

The invention provides a method for predicting the properties of a resin molded article, the method being high in analysis precision and easy to predict the properties compared with a moving analysis method. The method comprises a diffusing analyzing step S1, where a diffusing analysis unit (2) carries out diffusing analysis on the properties of the resin molded article, and a property predicting step (3), where a property predicting unit (3) predicts the properties of the resin molded article according to the preset corresponding relationship between the state of resin subjected to the diffusing analysis and the properties of the resin under the state and the state distribution obtained through the diffusing analysis. Preferably, a computer (1) further comprises a correspondence creating unit (4) for creating the corresponding relationship.

Description

technical field [0001] The present invention relates to a method of predicting physical properties of a resin molded product. Background technique [0002] In a metal-embedded composite resin part, the shrinkage rate during molding and the amount of expansion or contraction when the temperature changes during use are greatly different between the metal and the resin, so stress occurs. For example, in Figure 14 In the case of the composite resin part 10 as shown, when the composite resin part is molded and the temperature shifts to a low temperature, the dimensional change with respect to the metal 10A is very small, but the shrinkage of the resin 10B is large, and the resin 10B is formed by the metal 10A. Stretched shape, thus creating stress. In addition, depending on the magnitude of the stress, the resin 10B may be cracked. [0003] Therefore, in order to predict in advance the cracking of the resin 10B due to thermal aging (HA) and thermal fatigue (thermal shock, HS),...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B29C45/76
CPCB29C45/76
Inventor 奥泉了石田敦子
Owner POLYPLASTICS CO LTD