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Dispensing modules, applicator heads and nozzle holders for dispensing fluids, especially hot melt adhesives

A technology for distributing modules and holders, which is applied in the field of applicator heads and hot melt adhesives, and can solve problems such as difficulty in adjusting the precise length of the stroke

Active Publication Date: 2018-02-06
NORDSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The exact length of the stroke is very difficult to adjust in practice and some adjustment tolerances have to be accepted

Method used

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  • Dispensing modules, applicator heads and nozzle holders for dispensing fluids, especially hot melt adhesives
  • Dispensing modules, applicator heads and nozzle holders for dispensing fluids, especially hot melt adhesives
  • Dispensing modules, applicator heads and nozzle holders for dispensing fluids, especially hot melt adhesives

Examples

Experimental program
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Embodiment Construction

[0029] figure 1 A dispensing module 1 is shown. The dispensing module 1 has an actuator 3 , which in this example is in the form of a solenoid valve. The actuator 3 is connected to the module housing 5 of the distribution module 1 . The distribution module 1 also has an adapter 7 connected to the module housing 5 . The nozzle holder 9 is connected to the adapter 7 of the dispensing module 1 .

[0030] A connector seat 19 is provided on the actuator 3 , said connector seat 19 having an electrical connection 11 for supplying electrical energy to control the actuator 3 . In this embodiment, the module housing 5 has a two-piece structure. In this embodiment, the two-part module housing has a cylindrical housing 13 and a housing cover 15 . A muffler 17 is arranged in the housing cover 15 . The muffler is screwed into the housing cover 15 of the module housing.

[0031] figure 2 show figure 1 Side view of the distribution module 1. With regard to repeated reference number...

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PUM

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Abstract

The invention relates to a dispensing module (1) for an applicator head for dispensing fluids, especially hot melt adhesives, the dispensing module comprising: a module housing (5); a valve body, housed in the module housing (5): Adapter (7), the valve body extends through the adapter (7), the adapter includes a proximal end (49) and a distal end (41), and the distal end (41) is connected to the module housing by means of a threaded connection (51) (5); a nozzle holder (9), adapted to be inserted into a matching recess in the base member of the applicator head; and one or more sealing elements (57, 59, 61) for sealing the nozzle in a fluid-tight manner. The nozzle holder (9) and the base member are sealed relative to each other. According to the invention it is proposed that the nozzle holder (9) comprises a cavity (69) through which the valve body extends, the nozzle holder (9) being connected to the proximal end of the adapter (7) by means of a threaded connection (51) (49), the nozzle holder (9) includes a valve seat (79), the valve seat (79) is adapted to cooperate with the valve head (31) of the valve body, and the nozzle holder (9) includes a valve seat (79) Upstream of the elongated portion (75), within the elongated portion (75) the cavity (69) is limited to a narrow gap (77).

Description

technical field [0001] The invention relates to a dispensing module for an applicator head for dispensing fluids, in particular hot melt adhesives. [0002] The invention further relates to a nozzle holder for such a dispensing module and an applicator head with such a module. Background technique [0003] The units described above are used in all industrial fields in which fluids, especially adhesives, are to be applied to substrates via applicator heads. For this purpose, applicator heads usually have specially shaped nozzles. These nozzles can be nozzles with a slit-shaped or slot-shaped nozzle geometry, individual (jet) nozzles or a plurality of intermittently arranged nozzle openings. Depending on the respective field of use, the application by the application head is carried out in contact or non-contact relationship with the substrate. In recent years, the demand for systems that provide high operating efficiencies has increased significantly. In this way, the dev...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B05B1/30B05C5/02
CPCB05B1/3046B05B1/306B05C5/0237B05B15/65B05C5/0225
Inventor 曼弗雷德·米勒沃尔夫冈·马克斯
Owner NORDSON CORP
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