Coating device and coating method

Abstract

The present invention provides a film coating device and a film coating method for co-evaporating a substrate to be processed. The film coating device includes: a first vapor deposition source arranged under the substrate to be processed; a second vapor deposition source arranged under the substrate to be processed. the bottom of the substrate to be processed; and a first aperture shutter, which is arranged between the first evaporation source and the substrate to be processed, and the first aperture shutter includes a plurality of apertures with different aperture densities. The hole area can be rotated so that the hole area with different hole density is aligned with the first evaporation source. The film coating device and the film coating method of the present invention can conveniently adjust the ratio of different vapor deposition materials during the vapor deposition process without affecting the film quality, and the cost is low, which is suitable for industrial production applications.

Description

technical field [0001] The invention relates to a film coating device, in particular to a film coating device and a film coating method for co-evaporating a substrate to be processed. Background technique [0002] As we all know, the coating process is widely used in the industry, and is generally used in the metal processing industry, semiconductor industry, and optoelectronic industry. In recent years, due to the rapid development of the semiconductor industry and the optoelectronic industry, the coating technology has made significant progress. There are three forms of vacuum coating, namely evaporation coating, sputtering coating and ion plating. [0003] Evaporation coating is referred to as evaporation, which usually converts the thin film material from solid state to gaseous or ionized state. The gaseous or ionized material travels through the space from the evaporation source and reaches the basic surface. After the material reaches the surface of the substrate, it ...

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Problems solved by technology

[0004] However, when coating two different materials on the same substrate at the same time, it is difficult to adjust the ratio of the two materials "in real time" or even form a film layer with a gradient concentration.

like figure 1 As shown, the film coating device includes a first evaporation source 101 and a second evaporation source 102, which are simultaneously arranged below the substrate 200 to be processed. Different materials are loaded in the first evaporation source 101 and the second evaporation source 102, and at the same time For evaporation, if you want to adjust the ratio of the two evaporation materials during this period, you usually have to lower or increase the temperature of the first evaporation source 101 or the second evaporation source 102, but this heating and cooling process is slow, not only time-consuming It is laborious and will affect the coating quality, so it is not suitable for industrial production applications

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